JPH0379465U - - Google Patents
Info
- Publication number
- JPH0379465U JPH0379465U JP14041089U JP14041089U JPH0379465U JP H0379465 U JPH0379465 U JP H0379465U JP 14041089 U JP14041089 U JP 14041089U JP 14041089 U JP14041089 U JP 14041089U JP H0379465 U JPH0379465 U JP H0379465U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- flexible printed
- reinforcing plate
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 claims 3
- 230000002950 deficient Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図及び第２図は本考案実施例を示し、第１
図は、回路素子の実装状態を示す要部縦断面図、
第２図は、同上他の使用態様を示す要部縦断面図
、第３図及び第４図は従来例を示し、第３図は、
回路素子の実装状態を示す縦断面図、第４図は、
不良状態を示す縦断面図である。
１……Ｆ．Ｐ．Ｃ．、２……接着剤、３……銅
箔、４……補強板、９……アースパターン。
Figures 1 and 2 show an embodiment of the present invention;
The figure is a vertical cross-sectional view of main parts showing the mounting state of circuit elements.
FIG. 2 is a vertical sectional view of the main part showing the same usage as above, FIGS. 3 and 4 show a conventional example, and FIG.
FIG. 4 is a longitudinal cross-sectional view showing the mounting state of the circuit elements.
It is a longitudinal cross-sectional view showing a defective state. 1...F. P. C. , 2...adhesive, 3...copper foil, 4...reinforcement plate, 9...earth pattern.
Claims (1)
して補強板を接着剤により裏張りしたことを特徴
とする補強板付フレキシブルプリント基板。 ２ フレキシブルプリント基板上に形成したアー
スパターンを上記銅箔と接続したことを特徴とす
る請求項１記載の補強板付フレキシブルプリント
基板。[Claims for Utility Model Registration] 1. A flexible printed circuit board with a reinforcing plate, characterized in that the back side of the flexible printed circuit board is lined with a reinforcing plate with an adhesive via copper foil. 2. The flexible printed circuit board with a reinforcing plate according to claim 1, wherein a ground pattern formed on the flexible printed circuit board is connected to the copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14041089U JPH0379465U (en) | 1989-12-04 | 1989-12-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14041089U JPH0379465U (en) | 1989-12-04 | 1989-12-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0379465U true JPH0379465U (en) | 1991-08-13 |
Family
ID=31687386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14041089U Pending JPH0379465U (en) | 1989-12-04 | 1989-12-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0379465U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015050111A1 (en) * | 2013-10-01 | 2015-04-09 | 株式会社フジクラ | Wiring board assembly and method for producing same |
-
1989
- 1989-12-04 JP JP14041089U patent/JPH0379465U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015050111A1 (en) * | 2013-10-01 | 2015-04-09 | 株式会社フジクラ | Wiring board assembly and method for producing same |
| US10237971B2 (en) | 2013-10-01 | 2019-03-19 | Fujikura Ltd. | Wiring board assembly and method for producing same |