JPH01141013U - - Google Patents
Info
- Publication number
- JPH01141013U JPH01141013U JP3784588U JP3784588U JPH01141013U JP H01141013 U JPH01141013 U JP H01141013U JP 3784588 U JP3784588 U JP 3784588U JP 3784588 U JP3784588 U JP 3784588U JP H01141013 U JPH01141013 U JP H01141013U
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- additional member
- foil laminate
- circuit board
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 238000001746 injection moulding Methods 0.000 claims 1
- 239000000088 plastic resin Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の回路基板の一実施例の断面図
、第２図および第３図は第１図の回路基板の成形
工程を示す断面図である。第４図は従来の基板に
付加部材を取りつける手段の説明図である。
１……回路基板、２……回路、３……穴、４…
…位置決めピース、１０……付加部材尽き回路基
板。
FIG. 1 is a cross-sectional view of one embodiment of the circuit board of the present invention, and FIGS. 2 and 3 are cross-sectional views showing the molding process of the circuit board of FIG. 1. FIG. 4 is an explanatory diagram of a conventional means for attaching an additional member to a substrate. 1... Circuit board, 2... Circuit, 3... Hole, 4...
...Positioning piece, 10...Circuit board that has run out of additional components.
Claims (1)
基板であつて、前記付加部材は可塑性樹脂の射出
成形により成形されるとともに前記金属箔積層板
に固定されてなることを特徴とする回路基板。 A circuit board formed by combining a metal foil laminate and an additional member, wherein the additional member is molded by injection molding of a plastic resin and is fixed to the metal foil laminate. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3784588U JPH01141013U (en) | 1988-03-23 | 1988-03-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3784588U JPH01141013U (en) | 1988-03-23 | 1988-03-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01141013U true JPH01141013U (en) | 1989-09-27 |
Family
ID=31264419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3784588U Pending JPH01141013U (en) | 1988-03-23 | 1988-03-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01141013U (en) |
-
1988
- 1988-03-23 JP JP3784588U patent/JPH01141013U/ja active Pending
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