JPS63174430U - - Google Patents
Info
- Publication number
- JPS63174430U JPS63174430U JP18889886U JP18889886U JPS63174430U JP S63174430 U JPS63174430 U JP S63174430U JP 18889886 U JP18889886 U JP 18889886U JP 18889886 U JP18889886 U JP 18889886U JP S63174430 U JPS63174430 U JP S63174430U
- Authority
- JP
- Japan
- Prior art keywords
- board
- bonding
- tapered
- tapered hole
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 239000000057 synthetic resin Substances 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案基板の平面図、第２図はそのＡ
―Ａ線断面図、第３図は金属基板の裏面図、第４
図は本考案の要部のＢ―Ｂ線に沿う拡大断面図、
第５図は従来品の説明図。
１……金属基板、２……合成樹脂、３・４……
テーパ穴、２ａ・２ｂ……テーパ結合した樹脂。
Figure 1 is a plan view of the substrate of the present invention, and Figure 2 is its A.
- A cross-sectional view, Figure 3 is the back view of the metal substrate, Figure 4
The figure is an enlarged cross-sectional view along line B-B of the main part of the present invention,
FIG. 5 is an explanatory diagram of a conventional product. 1...Metal substrate, 2...Synthetic resin, 3/4...
Tapered holes, 2a, 2b...taper-bonded resin.
Claims (1)
行つた基板において、基板に結合用のテーパ穴を
設け、成形樹脂をそのテーパ穴に詰めてテーパ結
合させた薄型バリコンの基板。 A thin variable capacitor board that is made by insert molding a synthetic resin onto a thin metal board.The board has a tapered hole for bonding, and the tapered hole is filled with molded resin for tapered bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18889886U JPS63174430U (en) | 1986-12-08 | 1986-12-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18889886U JPS63174430U (en) | 1986-12-08 | 1986-12-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63174430U true JPS63174430U (en) | 1988-11-11 |
Family
ID=31140695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18889886U Pending JPS63174430U (en) | 1986-12-08 | 1986-12-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63174430U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61222714A (en) * | 1985-03-28 | 1986-10-03 | Mitsubishi Electric Corp | Manufacture of resin molded body |
-
1986
- 1986-12-08 JP JP18889886U patent/JPS63174430U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61222714A (en) * | 1985-03-28 | 1986-10-03 | Mitsubishi Electric Corp | Manufacture of resin molded body |