JPH0279039U - - Google Patents
Info
- Publication number
- JPH0279039U JPH0279039U JP15795488U JP15795488U JPH0279039U JP H0279039 U JPH0279039 U JP H0279039U JP 15795488 U JP15795488 U JP 15795488U JP 15795488 U JP15795488 U JP 15795488U JP H0279039 U JPH0279039 U JP H0279039U
- Authority
- JP
- Japan
- Prior art keywords
- pga
- semiconductor device
- large cap
- grooves
- pga substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例の斜視図、第２図は
他の実施例の斜視図、第３図は従来例を用いた封
止工程図である。
１……ＰＧＡ基板、２……小キヤツプ、３……
デイスペンサー、４……接着剤、５……大キヤツ
プ、６……溝。
FIG. 1 is a perspective view of one embodiment of the present invention, FIG. 2 is a perspective view of another embodiment, and FIG. 3 is a sealing process diagram using a conventional example. 1...PGA board, 2...small cap, 3...
Dispenser, 4...Adhesive, 5...Large cap, 6...Groove.
Claims (1)
において、ＰＧＡ基板に溝を設けることにより接
着剤が上記溝をつたわりＰＧＡ基板全体に放射状
にひろがることで、大キヤツプとＰＧＡ基板の接
着を均一にすることを特徴とする半導体装置。 A plastic PGA semiconductor device with a large cap is characterized in that by providing grooves in the PGA substrate, the adhesive passes through the grooves and spreads radially over the entire PGA substrate, thereby making the adhesion between the large cap and the PGA substrate uniform. semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15795488U JPH0279039U (en) | 1988-12-02 | 1988-12-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15795488U JPH0279039U (en) | 1988-12-02 | 1988-12-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0279039U true JPH0279039U (en) | 1990-06-18 |
Family
ID=31437848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15795488U Pending JPH0279039U (en) | 1988-12-02 | 1988-12-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0279039U (en) |
-
1988
- 1988-12-02 JP JP15795488U patent/JPH0279039U/ja active Pending
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