JPS6344479U - - Google Patents
Info
- Publication number
- JPS6344479U JPS6344479U JP13721886U JP13721886U JPS6344479U JP S6344479 U JPS6344479 U JP S6344479U JP 13721886 U JP13721886 U JP 13721886U JP 13721886 U JP13721886 U JP 13721886U JP S6344479 U JPS6344479 U JP S6344479U
- Authority
- JP
- Japan
- Prior art keywords
- optical isolator
- wiring board
- printed wiring
- semiconductor device
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000011810 insulating material Substances 0.000 claims 1
- 239000012778 molding material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図はこの考案の一実施例を示す説明図、第
２図は従来例の構成を示す説明図である。
１……オプテイカルアイソレータ、２……受動
部品、３……能動部品、４……プリント配線板、
５……リードピン、６……開口、７……エポキシ
樹脂。
FIG. 1 is an explanatory diagram showing an embodiment of this invention, and FIG. 2 is an explanatory diagram showing the configuration of a conventional example. 1... Optical isolator, 2... Passive components, 3... Active components, 4... Printed wiring board,
5... Lead pin, 6... Opening, 7... Epoxy resin.
Claims (1)
縁材料で一体に成型した光絶縁型半導体装置にお
いて、 オプテイカルアイソレータを含む電子部品がプ
リント配線板上に実装され、そのプリント配線板
は、そのオプテイカルアイソレータが対向する部
分に、成形材料流入用開口を備えてなることを特
徴とする光絶縁型半導体装置。[Scope of Claim for Utility Model Registration] In an optically insulated semiconductor device in which electronic components including an optical isolator are integrally molded with an insulating material, the electronic components including the optical isolator are mounted on a printed wiring board, and the printed wiring board An optically insulated semiconductor device, characterized in that the optical isolator is provided with an opening for inflowing a molding material in a portion thereof facing each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13721886U JPS6344479U (en) | 1986-09-05 | 1986-09-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13721886U JPS6344479U (en) | 1986-09-05 | 1986-09-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6344479U true JPS6344479U (en) | 1988-03-25 |
Family
ID=31041068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13721886U Pending JPS6344479U (en) | 1986-09-05 | 1986-09-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6344479U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5952665B2 (en) * | 1976-09-16 | 1984-12-20 | 三菱電線工業株式会社 | stabilized rubber composition |
-
1986
- 1986-09-05 JP JP13721886U patent/JPS6344479U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5952665B2 (en) * | 1976-09-16 | 1984-12-20 | 三菱電線工業株式会社 | stabilized rubber composition |
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