JPH0292946U - - Google Patents

Info

Publication number
JPH0292946U
JPH0292946U JP222189U JP222189U JPH0292946U JP H0292946 U JPH0292946 U JP H0292946U JP 222189 U JP222189 U JP 222189U JP 222189 U JP222189 U JP 222189U JP H0292946 U JPH0292946 U JP H0292946U
Authority
JP
Japan
Prior art keywords
hybrid
multilayer
covers
utility
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP222189U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP222189U priority Critical patent/JPH0292946U/ja
Publication of JPH0292946U publication Critical patent/JPH0292946U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案の一実施例による高密度ハイ
ブリツドIC構造を示す断面図、第2図は従来の
ハイブリツドIC構造を示す断面図である。図に
おいて、1,7は多層基板、2は多層基板内部配
線、3は部品、4は部品搭載パツド、5はワイヤ
、6はワイヤボンデイングパツド、8は基板間接
続用ワイヤボンデイングパツドを示す。なお、図
中、同一符号は同一、または相当部分を示す。
FIG. 1 is a sectional view showing a high-density hybrid IC structure according to an embodiment of this invention, and FIG. 2 is a sectional view showing a conventional hybrid IC structure. In the figure, 1 and 7 are multilayer boards, 2 is internal wiring of the multilayer board, 3 is a component, 4 is a component mounting pad, 5 is a wire, 6 is a wire bonding pad, and 8 is a wire bonding pad for connecting between boards. . In addition, in the figures, the same reference numerals indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 部品搭載用に堀込まれた穴を持つ多層基板と、
その穴を覆う多層基板を備えことを特徴とするハ
イブリツドIC構造。
A multilayer board with holes drilled for mounting components,
A hybrid IC structure characterized by comprising a multilayer substrate that covers the hole.
JP222189U 1989-01-12 1989-01-12 Pending JPH0292946U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP222189U JPH0292946U (en) 1989-01-12 1989-01-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP222189U JPH0292946U (en) 1989-01-12 1989-01-12

Publications (1)

Publication Number Publication Date
JPH0292946U true JPH0292946U (en) 1990-07-24

Family

ID=31202803

Family Applications (1)

Application Number Title Priority Date Filing Date
JP222189U Pending JPH0292946U (en) 1989-01-12 1989-01-12

Country Status (1)

Country Link
JP (1) JPH0292946U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4989161A (en) * 1972-12-12 1974-08-26

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4989161A (en) * 1972-12-12 1974-08-26

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