JPH0292946U - - Google Patents
Info
- Publication number
- JPH0292946U JPH0292946U JP222189U JP222189U JPH0292946U JP H0292946 U JPH0292946 U JP H0292946U JP 222189 U JP222189 U JP 222189U JP 222189 U JP222189 U JP 222189U JP H0292946 U JPH0292946 U JP H0292946U
- Authority
- JP
- Japan
- Prior art keywords
- hybrid
- multilayer
- covers
- utility
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案の一実施例による高密度ハイ
ブリツドＩＣ構造を示す断面図、第２図は従来の
ハイブリツドＩＣ構造を示す断面図である。図に
おいて、１，７は多層基板、２は多層基板内部配
線、３は部品、４は部品搭載パツド、５はワイヤ
、６はワイヤボンデイングパツド、８は基板間接
続用ワイヤボンデイングパツドを示す。なお、図
中、同一符号は同一、または相当部分を示す。
FIG. 1 is a sectional view showing a high-density hybrid IC structure according to an embodiment of this invention, and FIG. 2 is a sectional view showing a conventional hybrid IC structure. In the figure, 1 and 7 are multilayer boards, 2 is internal wiring of the multilayer board, 3 is a component, 4 is a component mounting pad, 5 is a wire, 6 is a wire bonding pad, and 8 is a wire bonding pad for connecting between boards. . In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
その穴を覆う多層基板を備えことを特徴とするハ
イブリツドＩＣ構造。 A multilayer board with holes drilled for mounting components,
A hybrid IC structure characterized by comprising a multilayer substrate that covers the hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP222189U JPH0292946U (en) | 1989-01-12 | 1989-01-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP222189U JPH0292946U (en) | 1989-01-12 | 1989-01-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0292946U true JPH0292946U (en) | 1990-07-24 |
Family
ID=31202803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP222189U Pending JPH0292946U (en) | 1989-01-12 | 1989-01-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0292946U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4989161A (en) * | 1972-12-12 | 1974-08-26 |
-
1989
- 1989-01-12 JP JP222189U patent/JPH0292946U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4989161A (en) * | 1972-12-12 | 1974-08-26 |
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