JPH028145U - - Google Patents

Info

Publication number
JPH028145U
JPH028145U JP1988086132U JP8613288U JPH028145U JP H028145 U JPH028145 U JP H028145U JP 1988086132 U JP1988086132 U JP 1988086132U JP 8613288 U JP8613288 U JP 8613288U JP H028145 U JPH028145 U JP H028145U
Authority
JP
Japan
Prior art keywords
electronic circuit
sealing
hybrid integrated
circuit
constituted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988086132U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988086132U priority Critical patent/JPH028145U/ja
Publication of JPH028145U publication Critical patent/JPH028145U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図、第２図は各々この考案の第１、第２の
実施例による混成集積回路を示す一部断面図、第
３図、第４図は各々従来の混成集積回路の構成例
を示す断面図である。 ３……半導体素子、２０，２１……多層回路基
板。 1 and 2 are partial cross-sectional views showing hybrid integrated circuits according to the first and second embodiments of this invention, respectively, and FIGS. 3 and 4 show configuration examples of conventional hybrid integrated circuits, respectively. FIG. 3...Semiconductor element, 20, 21...Multilayer circuit board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子および表面弾性波素子の少なくとも
一方の素子を封止する封止部材を、内部に電子回
路を備えた複数の多層回路基板で構成し、前記素
子と前記電子回路とを電気的に接続したことを特
徴とする混成集積回路。 A sealing member for sealing at least one of a semiconductor element and a surface acoustic wave element is constituted by a plurality of multilayer circuit boards each having an electronic circuit therein, and the element and the electronic circuit are electrically connected. A hybrid integrated circuit characterized by:
JP1988086132U 1988-06-29 1988-06-29 Pending JPH028145U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988086132U JPH028145U (en) 1988-06-29 1988-06-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988086132U JPH028145U (en) 1988-06-29 1988-06-29

Publications (1)

Publication Number Publication Date
JPH028145U true JPH028145U (en) 1990-01-19

Family

ID=31310777

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988086132U Pending JPH028145U (en) 1988-06-29 1988-06-29

Country Status (1)

Country Link
JP (1) JPH028145U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0779708A2 (en) 1995-12-14 1997-06-18 Murata Manufacturing Co., Ltd. Surface acoustic wave apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0779708A2 (en) 1995-12-14 1997-06-18 Murata Manufacturing Co., Ltd. Surface acoustic wave apparatus

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