JPH028145U - - Google Patents
Info
- Publication number
- JPH028145U JPH028145U JP1988086132U JP8613288U JPH028145U JP H028145 U JPH028145 U JP H028145U JP 1988086132 U JP1988086132 U JP 1988086132U JP 8613288 U JP8613288 U JP 8613288U JP H028145 U JPH028145 U JP H028145U
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- sealing
- hybrid integrated
- circuit
- constituted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 2
- 238000010897 surface acoustic wave method Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
第1図、第2図は各々この考案の第1、第2の
実施例による混成集積回路を示す一部断面図、第
3図、第4図は各々従来の混成集積回路の構成例
を示す断面図である。
3……半導体素子、20,21……多層回路基
板。
1 and 2 are partial cross-sectional views showing hybrid integrated circuits according to the first and second embodiments of this invention, respectively, and FIGS. 3 and 4 show configuration examples of conventional hybrid integrated circuits, respectively. FIG. 3...Semiconductor element, 20, 21...Multilayer circuit board.
Claims (1)
一方の素子を封止する封止部材を、内部に電子回
路を備えた複数の多層回路基板で構成し、前記素
子と前記電子回路とを電気的に接続したことを特
徴とする混成集積回路。 A sealing member for sealing at least one of a semiconductor element and a surface acoustic wave element is constituted by a plurality of multilayer circuit boards each having an electronic circuit therein, and the element and the electronic circuit are electrically connected. A hybrid integrated circuit characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988086132U JPH028145U (en) | 1988-06-29 | 1988-06-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988086132U JPH028145U (en) | 1988-06-29 | 1988-06-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH028145U true JPH028145U (en) | 1990-01-19 |
Family
ID=31310777
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988086132U Pending JPH028145U (en) | 1988-06-29 | 1988-06-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH028145U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0779708A2 (en) | 1995-12-14 | 1997-06-18 | Murata Manufacturing Co., Ltd. | Surface acoustic wave apparatus |
-
1988
- 1988-06-29 JP JP1988086132U patent/JPH028145U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0779708A2 (en) | 1995-12-14 | 1997-06-18 | Murata Manufacturing Co., Ltd. | Surface acoustic wave apparatus |
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