JPH0284368U - - Google Patents

Info

Publication number
JPH0284368U
JPH0284368U JP16358788U JP16358788U JPH0284368U JP H0284368 U JPH0284368 U JP H0284368U JP 16358788 U JP16358788 U JP 16358788U JP 16358788 U JP16358788 U JP 16358788U JP H0284368 U JPH0284368 U JP H0284368U
Authority
JP
Japan
Prior art keywords
hybrid
solder bumps
surfaces face
whose surfaces
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16358788U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16358788U priority Critical patent/JPH0284368U/ja
Publication of JPH0284368U publication Critical patent/JPH0284368U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Combinations Of Printed Boards (AREA)
JP16358788U 1988-12-17 1988-12-17 Pending JPH0284368U (me)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16358788U JPH0284368U (me) 1988-12-17 1988-12-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16358788U JPH0284368U (me) 1988-12-17 1988-12-17

Publications (1)

Publication Number Publication Date
JPH0284368U true JPH0284368U (me) 1990-06-29

Family

ID=31448440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16358788U Pending JPH0284368U (me) 1988-12-17 1988-12-17

Country Status (1)

Country Link
JP (1) JPH0284368U (me)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04102384A (ja) * 1990-08-21 1992-04-03 Rohm Co Ltd 電子回路装置
JP2000315866A (ja) * 1999-04-30 2000-11-14 Ibiden Co Ltd 多層配線板およびその製造方法
JP2007184362A (ja) * 2006-01-05 2007-07-19 Hitachi Cable Ltd 積層型半導体装置及びその製造方法
JP2008204998A (ja) * 2007-02-16 2008-09-04 Toppan Printing Co Ltd 高集積半導体装置
JP2010080749A (ja) * 2008-09-26 2010-04-08 Kyocera Corp 回路基板構造及び電子機器
JP2010103568A (ja) * 2010-02-05 2010-05-06 Hitachi Cable Ltd 積層型半導体装置及びその製造方法
WO2015083249A1 (ja) * 2013-12-04 2015-06-11 株式会社日立製作所 多層配線基板およびその製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04102384A (ja) * 1990-08-21 1992-04-03 Rohm Co Ltd 電子回路装置
JP2000315866A (ja) * 1999-04-30 2000-11-14 Ibiden Co Ltd 多層配線板およびその製造方法
JP2007184362A (ja) * 2006-01-05 2007-07-19 Hitachi Cable Ltd 積層型半導体装置及びその製造方法
JP4650269B2 (ja) * 2006-01-05 2011-03-16 日立電線株式会社 積層型半導体装置の製造方法
JP2008204998A (ja) * 2007-02-16 2008-09-04 Toppan Printing Co Ltd 高集積半導体装置
JP2010080749A (ja) * 2008-09-26 2010-04-08 Kyocera Corp 回路基板構造及び電子機器
JP2010103568A (ja) * 2010-02-05 2010-05-06 Hitachi Cable Ltd 積層型半導体装置及びその製造方法
WO2015083249A1 (ja) * 2013-12-04 2015-06-11 株式会社日立製作所 多層配線基板およびその製造方法

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