JPH0284368U - - Google Patents
Info
- Publication number
- JPH0284368U JPH0284368U JP16358788U JP16358788U JPH0284368U JP H0284368 U JPH0284368 U JP H0284368U JP 16358788 U JP16358788 U JP 16358788U JP 16358788 U JP16358788 U JP 16358788U JP H0284368 U JPH0284368 U JP H0284368U
- Authority
- JP
- Japan
- Prior art keywords
- hybrid
- solder bumps
- surfaces face
- whose surfaces
- boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16358788U JPH0284368U (cs) | 1988-12-17 | 1988-12-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16358788U JPH0284368U (cs) | 1988-12-17 | 1988-12-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0284368U true JPH0284368U (cs) | 1990-06-29 |
Family
ID=31448440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16358788U Pending JPH0284368U (cs) | 1988-12-17 | 1988-12-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0284368U (cs) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04102384A (ja) * | 1990-08-21 | 1992-04-03 | Rohm Co Ltd | 電子回路装置 |
| JP2000315866A (ja) * | 1999-04-30 | 2000-11-14 | Ibiden Co Ltd | 多層配線板およびその製造方法 |
| JP2007184362A (ja) * | 2006-01-05 | 2007-07-19 | Hitachi Cable Ltd | 積層型半導体装置及びその製造方法 |
| JP2008204998A (ja) * | 2007-02-16 | 2008-09-04 | Toppan Printing Co Ltd | 高集積半導体装置 |
| JP2010080749A (ja) * | 2008-09-26 | 2010-04-08 | Kyocera Corp | 回路基板構造及び電子機器 |
| JP2010103568A (ja) * | 2010-02-05 | 2010-05-06 | Hitachi Cable Ltd | 積層型半導体装置及びその製造方法 |
| WO2015083249A1 (ja) * | 2013-12-04 | 2015-06-11 | 株式会社日立製作所 | 多層配線基板およびその製造方法 |
-
1988
- 1988-12-17 JP JP16358788U patent/JPH0284368U/ja active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04102384A (ja) * | 1990-08-21 | 1992-04-03 | Rohm Co Ltd | 電子回路装置 |
| JP2000315866A (ja) * | 1999-04-30 | 2000-11-14 | Ibiden Co Ltd | 多層配線板およびその製造方法 |
| JP2007184362A (ja) * | 2006-01-05 | 2007-07-19 | Hitachi Cable Ltd | 積層型半導体装置及びその製造方法 |
| JP2008204998A (ja) * | 2007-02-16 | 2008-09-04 | Toppan Printing Co Ltd | 高集積半導体装置 |
| JP2010080749A (ja) * | 2008-09-26 | 2010-04-08 | Kyocera Corp | 回路基板構造及び電子機器 |
| JP2010103568A (ja) * | 2010-02-05 | 2010-05-06 | Hitachi Cable Ltd | 積層型半導体装置及びその製造方法 |
| WO2015083249A1 (ja) * | 2013-12-04 | 2015-06-11 | 株式会社日立製作所 | 多層配線基板およびその製造方法 |