JPH0341934U - - Google Patents
Info
- Publication number
- JPH0341934U JPH0341934U JP10331989U JP10331989U JPH0341934U JP H0341934 U JPH0341934 U JP H0341934U JP 10331989 U JP10331989 U JP 10331989U JP 10331989 U JP10331989 U JP 10331989U JP H0341934 U JPH0341934 U JP H0341934U
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- flexible substrate
- curved portion
- bonding pads
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10331989U JPH0341934U (cs) | 1989-09-01 | 1989-09-01 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10331989U JPH0341934U (cs) | 1989-09-01 | 1989-09-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0341934U true JPH0341934U (cs) | 1991-04-22 |
Family
ID=31652165
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10331989U Pending JPH0341934U (cs) | 1989-09-01 | 1989-09-01 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0341934U (cs) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022168478A1 (ja) * | 2021-02-05 | 2022-08-11 | 株式会社村田製作所 | モジュール |
-
1989
- 1989-09-01 JP JP10331989U patent/JPH0341934U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022168478A1 (ja) * | 2021-02-05 | 2022-08-11 | 株式会社村田製作所 | モジュール |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS62184775U (cs) | ||
JPH0341934U (cs) | ||
JPH0284368U (cs) | ||
JPS63127171U (cs) | ||
JPS6232550U (cs) | ||
JPS62134254U (cs) | ||
JPS6338328U (cs) | ||
JPS6035569U (ja) | チップキャリアのバンプ接続構造 | |
JPS6338368U (cs) | ||
JPS6192064U (cs) | ||
JPH02110361U (cs) | ||
JPS6260069U (cs) | ||
JPS6413144U (cs) | ||
JPS62126842U (cs) | ||
JPS6130248U (ja) | 多層セラミツク基板 | |
JPH0230069U (cs) | ||
JPS61131870U (cs) | ||
JPH01129874U (cs) | ||
JPH0448661U (cs) | ||
JPS6042765U (ja) | リ−ドレスチップキャリアとプリント基板との接続構造 | |
JPH0229541U (cs) | ||
JPH0381643U (cs) | ||
JPS60111064U (ja) | ハイブリツドic用回路基板 | |
JPS6214751U (cs) | ||
JPH01173957U (cs) |