JPH0284303U - - Google Patents
Info
- Publication number
- JPH0284303U JPH0284303U JP16358588U JP16358588U JPH0284303U JP H0284303 U JPH0284303 U JP H0284303U JP 16358588 U JP16358588 U JP 16358588U JP 16358588 U JP16358588 U JP 16358588U JP H0284303 U JPH0284303 U JP H0284303U
- Authority
- JP
- Japan
- Prior art keywords
- coil
- thick film
- wire
- constructed
- coil wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000000696 magnetic material Substances 0.000 claims 1
Landscapes
- Coils Or Transformers For Communication (AREA)
Description
第１図は本考案による厚膜コイルの構造を示す
側面図、第２図はそのコイル部を示す平面図、第
３図は半田バンプ結合前の状態を示す斜視図、第
４図は本考案の他の実施例を示す側面図、第５図
はそのコイル部を示す平面図、第６図は本考案の
他の実施例をさらに示すコイル部の平面図である
。
Fig. 1 is a side view showing the structure of the thick film coil according to the invention, Fig. 2 is a plan view showing the coil portion, Fig. 3 is a perspective view showing the state before solder bump bonding, and Fig. 4 is the invention according to the invention. 5 is a side view showing another embodiment of the present invention, FIG. 5 is a plan view showing the coil portion thereof, and FIG. 6 is a plan view of the coil portion further showing another embodiment of the present invention.
Claims (1)
、複数本の第１のコイル線材を厚膜印刷により形
成し、他方の基板の対向面にも厚膜印刷により複
数本の第２のコイル線材を形成し、第１のコイル
線材の両端部を第２のコイル線材の対応する端部
に半田バンプにより接合して厚膜コイルを構成し
たことを特徴とする厚膜コイルの構造。 ２ 前記厚膜コイル中に磁性材が設けられている
ことを特徴とする請求項１記載の厚膜コイルの構
造。 ３ 前記第１のコイル線材と第２のコイル線材と
をそれぞれ１本おきに接続してトランスを構成し
たことを特徴とする請求項１または２記載の厚膜
コイルの構造。[Claims for Utility Model Registration] 1. A plurality of first coil wires are formed by thick film printing on one opposing surface of two substrates whose plate surfaces face each other, and a thick layer is also formed on the opposing surface of the other substrate. A thick film coil is constructed by forming a plurality of second coil wires by film printing, and joining both ends of the first coil wire to corresponding ends of the second coil wire with solder bumps. The structure of the thick film coil. 2. The thick film coil structure according to claim 1, wherein a magnetic material is provided in the thick film coil. 3. The thick film coil structure according to claim 1 or 2, wherein a transformer is constructed by connecting every other first coil wire and second coil wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16358588U JPH0284303U (en) | 1988-12-17 | 1988-12-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16358588U JPH0284303U (en) | 1988-12-17 | 1988-12-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0284303U true JPH0284303U (en) | 1990-06-29 |
Family
ID=31448436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16358588U Pending JPH0284303U (en) | 1988-12-17 | 1988-12-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0284303U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004311830A (en) * | 2003-04-09 | 2004-11-04 | Mitsubishi Materials Corp | Stacked common mode choke coil and its manufacturing method |
| JP2008306133A (en) * | 2007-06-11 | 2008-12-18 | Nec Corp | Electronic device |
| CN102870192A (en) * | 2010-03-25 | 2013-01-09 | 高通股份有限公司 | Three dimensional inductor and transformer design methodology of glass technology |
| JP2017513219A (en) * | 2014-03-28 | 2017-05-25 | クアルコム，インコーポレイテッド | 3D pillar inductor |
-
1988
- 1988-12-17 JP JP16358588U patent/JPH0284303U/ja active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004311830A (en) * | 2003-04-09 | 2004-11-04 | Mitsubishi Materials Corp | Stacked common mode choke coil and its manufacturing method |
| JP2008306133A (en) * | 2007-06-11 | 2008-12-18 | Nec Corp | Electronic device |
| CN102870192A (en) * | 2010-03-25 | 2013-01-09 | 高通股份有限公司 | Three dimensional inductor and transformer design methodology of glass technology |
| JP2013524488A (en) * | 2010-03-25 | 2013-06-17 | クアルコム，インコーポレイテッド | Glass technology 3D inductor and transformer design method |
| KR101430608B1 (en) * | 2010-03-25 | 2014-08-14 | 퀄컴 인코포레이티드 | Three dimensional inductor and transformer design methodology of glass technology |
| CN102870192B (en) * | 2010-03-25 | 2016-06-08 | 高通股份有限公司 | The three dimensional inductor of glass technology and design of transformer method |
| JP2017513219A (en) * | 2014-03-28 | 2017-05-25 | クアルコム，インコーポレイテッド | 3D pillar inductor |
| US10553671B2 (en) | 2014-03-28 | 2020-02-04 | Qualcomm Incorporated | 3D pillar inductor |
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