JPS61182046U - - Google Patents
Info
- Publication number
- JPS61182046U JPS61182046U JP6651485U JP6651485U JPS61182046U JP S61182046 U JPS61182046 U JP S61182046U JP 6651485 U JP6651485 U JP 6651485U JP 6651485 U JP6651485 U JP 6651485U JP S61182046 U JPS61182046 U JP S61182046U
- Authority
- JP
- Japan
- Prior art keywords
- film hybrid
- thick
- terminals
- bonded
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図ａは本考案の一実施例の斜視図、第１図
ｂはその側面図、第２図ａ及び、第３図ａは、本
考案の一実施例の製造方法を説明するための斜視
図、第２図ｂ及び第３図ｂはそれぞれの側面図で
ある。第４図は高密度化を考慮した従来例の側面
図である。
１，２，５，６……素子、３，７……端子、４
，８……基板。
FIG. 1a is a perspective view of an embodiment of the present invention, FIG. 1b is a side view thereof, and FIGS. 2a and 3a are diagrams for explaining the manufacturing method of an embodiment of the present invention. The perspective view, FIG. 2b and FIG. 3b are respective side views. FIG. 4 is a side view of a conventional example in consideration of high density. 1, 2, 5, 6...Element, 3, 7...Terminal, 4
, 8...Substrate.
Claims (1)
子未実装面を接着剤等により接合し、その両側の
個々の基板それぞれに実装面と垂直方向の端子を
設けたことを特徴とする高密度実装厚膜混成ＩＣ
。 High-density technology characterized by the fact that the non-element-mounted surfaces of two thick-film hybrid ICs with elements mounted on one side are bonded using adhesive, etc., and terminals are provided in the direction perpendicular to the mounting surface on each individual board on both sides. Mounted thick film hybrid IC
.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6651485U JPS61182046U (en) | 1985-05-07 | 1985-05-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6651485U JPS61182046U (en) | 1985-05-07 | 1985-05-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61182046U true JPS61182046U (en) | 1986-11-13 |
Family
ID=30599491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6651485U Pending JPS61182046U (en) | 1985-05-07 | 1985-05-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61182046U (en) |
-
1985
- 1985-05-07 JP JP6651485U patent/JPS61182046U/ja active Pending
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