JPH0283913A - チップ状電子部品端面の導電ペースト塗布方法 - Google Patents
チップ状電子部品端面の導電ペースト塗布方法Info
- Publication number
- JPH0283913A JPH0283913A JP63234858A JP23485888A JPH0283913A JP H0283913 A JPH0283913 A JP H0283913A JP 63234858 A JP63234858 A JP 63234858A JP 23485888 A JP23485888 A JP 23485888A JP H0283913 A JPH0283913 A JP H0283913A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- holding plate
- plate
- conductive paste
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims description 9
- 239000013013 elastic material Substances 0.000 claims description 7
- 238000010020 roller printing Methods 0.000 abstract description 3
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 2
- 239000010935 stainless steel Substances 0.000 abstract description 2
- 238000007796 conventional method Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63234858A JPH0283913A (ja) | 1988-09-21 | 1988-09-21 | チップ状電子部品端面の導電ペースト塗布方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63234858A JPH0283913A (ja) | 1988-09-21 | 1988-09-21 | チップ状電子部品端面の導電ペースト塗布方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0283913A true JPH0283913A (ja) | 1990-03-26 |
JPH044739B2 JPH044739B2 (enrdf_load_stackoverflow) | 1992-01-29 |
Family
ID=16977453
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63234858A Granted JPH0283913A (ja) | 1988-09-21 | 1988-09-21 | チップ状電子部品端面の導電ペースト塗布方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0283913A (enrdf_load_stackoverflow) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0572128U (ja) * | 1992-02-29 | 1993-09-28 | 太陽誘電株式会社 | チップ状部品保持用キャリアプレート |
US5337893A (en) * | 1992-07-22 | 1994-08-16 | Electro Scientific Industries, Inc. | High capacity carrier plate |
BE1010034A3 (fr) * | 1995-08-18 | 1997-11-04 | Siemens Matsushita Components | Dispositif de fixation de composants lors de l'application d'electrodes. |
US6048733A (en) * | 1997-06-27 | 2000-04-11 | Tokyo Gas Co., Ltd. | DMS detecting agent, method for preparing the same and DMS detector tube |
-
1988
- 1988-09-21 JP JP63234858A patent/JPH0283913A/ja active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0572128U (ja) * | 1992-02-29 | 1993-09-28 | 太陽誘電株式会社 | チップ状部品保持用キャリアプレート |
US5337893A (en) * | 1992-07-22 | 1994-08-16 | Electro Scientific Industries, Inc. | High capacity carrier plate |
BE1010034A3 (fr) * | 1995-08-18 | 1997-11-04 | Siemens Matsushita Components | Dispositif de fixation de composants lors de l'application d'electrodes. |
US6048733A (en) * | 1997-06-27 | 2000-04-11 | Tokyo Gas Co., Ltd. | DMS detecting agent, method for preparing the same and DMS detector tube |
Also Published As
Publication number | Publication date |
---|---|
JPH044739B2 (enrdf_load_stackoverflow) | 1992-01-29 |
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Legal Events
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EXPY | Cancellation because of completion of term | ||
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