JPH028070U - - Google Patents
Info
- Publication number
- JPH028070U JPH028070U JP8359688U JP8359688U JPH028070U JP H028070 U JPH028070 U JP H028070U JP 8359688 U JP8359688 U JP 8359688U JP 8359688 U JP8359688 U JP 8359688U JP H028070 U JPH028070 U JP H028070U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- plate
- emitting diode
- electrodes
- synthetic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000605 extraction Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 229920003002 synthetic resin Polymers 0.000 claims description 3
- 239000000057 synthetic resin Substances 0.000 claims description 3
- 238000005286 illumination Methods 0.000 claims 2
- 238000009413 insulation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988083596U JPH0648892Y2 (ja) | 1988-06-24 | 1988-06-24 | 面照光ledランプ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988083596U JPH0648892Y2 (ja) | 1988-06-24 | 1988-06-24 | 面照光ledランプ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH028070U true JPH028070U (US06589383-20030708-C00041.png) | 1990-01-18 |
JPH0648892Y2 JPH0648892Y2 (ja) | 1994-12-12 |
Family
ID=31308309
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988083596U Expired - Lifetime JPH0648892Y2 (ja) | 1988-06-24 | 1988-06-24 | 面照光ledランプ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0648892Y2 (US06589383-20030708-C00041.png) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006529058A (ja) * | 2003-05-28 | 2006-12-28 | ソウル セミコンダクター シーオー エルティディ | 少なくとも2個のヒートシンクを有する発光ダイオードパッケージ及び発光ダイオードシステム |
JP2007103940A (ja) * | 2005-10-04 | 2007-04-19 | Samsung Electro-Mechanics Co Ltd | 高出力発光ダイオードパッケージ |
JP2011003811A (ja) * | 2009-06-22 | 2011-01-06 | Toyoda Gosei Co Ltd | Ledパッケージ |
JP2011254080A (ja) * | 2010-06-01 | 2011-12-15 | Lg Innotek Co Ltd | 発光素子パッケージ |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6037260U (ja) * | 1983-08-22 | 1985-03-14 | 舶用電球株式会社 | 発光ダイオ−ドランプの発光部 |
JPS6037261U (ja) * | 1983-08-22 | 1985-03-14 | 舶用電球株式会社 | 発光ダイオ−ドランプの発光部の放熱構造 |
JPS60102775A (ja) * | 1983-11-09 | 1985-06-06 | Toshiba Corp | 発光表示装置 |
JPS6092851U (ja) * | 1983-12-01 | 1985-06-25 | 舶用電球株式会社 | 発光ダイオ−ドランプの発光部 |
-
1988
- 1988-06-24 JP JP1988083596U patent/JPH0648892Y2/ja not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6037260U (ja) * | 1983-08-22 | 1985-03-14 | 舶用電球株式会社 | 発光ダイオ−ドランプの発光部 |
JPS6037261U (ja) * | 1983-08-22 | 1985-03-14 | 舶用電球株式会社 | 発光ダイオ−ドランプの発光部の放熱構造 |
JPS60102775A (ja) * | 1983-11-09 | 1985-06-06 | Toshiba Corp | 発光表示装置 |
JPS6092851U (ja) * | 1983-12-01 | 1985-06-25 | 舶用電球株式会社 | 発光ダイオ−ドランプの発光部 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006529058A (ja) * | 2003-05-28 | 2006-12-28 | ソウル セミコンダクター シーオー エルティディ | 少なくとも2個のヒートシンクを有する発光ダイオードパッケージ及び発光ダイオードシステム |
JP2007103940A (ja) * | 2005-10-04 | 2007-04-19 | Samsung Electro-Mechanics Co Ltd | 高出力発光ダイオードパッケージ |
JP2010206231A (ja) * | 2005-10-04 | 2010-09-16 | Samsung Electro-Mechanics Co Ltd | 高出力発光ダイオードパッケージ |
JP2011003811A (ja) * | 2009-06-22 | 2011-01-06 | Toyoda Gosei Co Ltd | Ledパッケージ |
JP2011254080A (ja) * | 2010-06-01 | 2011-12-15 | Lg Innotek Co Ltd | 発光素子パッケージ |
Also Published As
Publication number | Publication date |
---|---|
JPH0648892Y2 (ja) | 1994-12-12 |