JPH0271676U - - Google Patents

Info

Publication number
JPH0271676U
JPH0271676U JP1988151577U JP15157788U JPH0271676U JP H0271676 U JPH0271676 U JP H0271676U JP 1988151577 U JP1988151577 U JP 1988151577U JP 15157788 U JP15157788 U JP 15157788U JP H0271676 U JPH0271676 U JP H0271676U
Authority
JP
Japan
Prior art keywords
circuit board
connection terminals
electronic device
card
type electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988151577U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988151577U priority Critical patent/JPH0271676U/ja
Priority to US07/438,206 priority patent/US5019700A/en
Publication of JPH0271676U publication Critical patent/JPH0271676U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10666—Plated through-hole for surface mounting on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Combinations Of Printed Boards (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の要部の縦断面図、
第２図は本考案の他の実施例の要部の縦断面図、
第３図は一般的なカード型電子機器の平面図、第
４図は従来の多機能タイプのカード型電子機器の
一部の縦断面図である。 ２……電子部品、４……保護用部材、１４……
回路基板、１７，２５……端子基板、２０……導
電性部材、２３，２４，２６，２７……外部接続
端子。

Claims (1)

    【実用新案登録請求の範囲】
  1. ＬＳＩ等の電子部品が搭載された回路基板の少
    なくとも表面に、この表面側に配設された外部接
    続端子の配設個所を除き保護用部材が重合固着さ
    れてなるカード型電子機器において、前記外部接
    続端子を表面に備えた端子基板を、該外部接続端
    子が前記回路基板に電気的接続されるよう該端子
    基板の裏面を導電性部材により当該回路基板の前
    記配設個所に接着してなることを特徴とするカー
    ド型電子機器。
JP1988151577U 1988-11-21 1988-11-21 Pending JPH0271676U (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1988151577U JPH0271676U (ja) 1988-11-21 1988-11-21
US07/438,206 US5019700A (en) 1988-11-21 1989-11-20 Multifunction card type electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988151577U JPH0271676U (ja) 1988-11-21 1988-11-21

Publications (1)

Publication Number Publication Date
JPH0271676U true JPH0271676U (ja) 1990-05-31

Family

ID=15521560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988151577U Pending JPH0271676U (ja) 1988-11-21 1988-11-21

Country Status (2)

Country Link
US (1) US5019700A (ja)
JP (1) JPH0271676U (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6027027A (en) * 1996-05-31 2000-02-22 Lucent Technologies Inc. Luggage tag assembly
US6353420B1 (en) * 1999-04-28 2002-03-05 Amerasia International Technology, Inc. Wireless article including a plural-turn loop antenna
US20060237543A1 (en) * 2005-04-20 2006-10-26 Ngk Spark Plug Co., Ltd. Card, manufacturing method of card, and thin type battery for card

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3153769C2 (de) * 1981-04-14 1995-10-26 Gao Ges Automation Org Trägerelement zum Einbau in Ausweiskarten
JPS61131186A (ja) * 1984-11-30 1986-06-18 Casio Comput Co Ltd Ｉｃカ−ド
US4841134A (en) * 1985-07-27 1989-06-20 Dai Nippon Insatsu Kabushika Kaisha IC card
US4943708A (en) * 1988-02-01 1990-07-24 Motorola, Inc. Data device module having locking groove

Also Published As

Publication number Publication date
US5019700A (en) 1991-05-28

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