JPH0270859U - - Google Patents
Info
- Publication number
- JPH0270859U JPH0270859U JP15020888U JP15020888U JPH0270859U JP H0270859 U JPH0270859 U JP H0270859U JP 15020888 U JP15020888 U JP 15020888U JP 15020888 U JP15020888 U JP 15020888U JP H0270859 U JPH0270859 U JP H0270859U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- flux
- bump surface
- heating
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 230000004907 flux Effects 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 4
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000001179 sorption measurement Methods 0.000 claims 1
- 210000000078 claw Anatomy 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15020888U JPH0270859U (de) | 1988-11-17 | 1988-11-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15020888U JPH0270859U (de) | 1988-11-17 | 1988-11-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0270859U true JPH0270859U (de) | 1990-05-30 |
Family
ID=31423142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15020888U Pending JPH0270859U (de) | 1988-11-17 | 1988-11-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0270859U (de) |
-
1988
- 1988-11-17 JP JP15020888U patent/JPH0270859U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0270859U (de) | ||
| JPH0259860U (de) | ||
| JPH04315494A (ja) | 回路部品へのワイヤ接続方法 | |
| MY113624A (en) | Soldering apparatus and a method thereof | |
| JPS6177162U (de) | ||
| JPH08167772A (ja) | 表面実装電子部品の予備はんだ付け方法 | |
| JPS62169770U (de) | ||
| JP2586066B2 (ja) | 半田供給用フィルムおよび半田付け方法 | |
| JPS6371970U (de) | ||
| JPH0196259U (de) | ||
| JPH0625030Y2 (ja) | フレキシブルプリント配線板とプリント基板の接続構造 | |
| JPH0787268B2 (ja) | フラットパッケージ型ｉｃの実装方法 | |
| JPH0783176B2 (ja) | 微小リードピッチ部品のはんだ付け方法 | |
| JPS6419688A (en) | Method of soldering lead to printed wiring board | |
| JPS5835791B2 (ja) | ビデオヘツドとリ−ド線とのはんだ付け方法 | |
| JPH02201996A (ja) | チップキャリアへの半田供給方法 | |
| JPH0356120U (de) | ||
| JPS60186964U (ja) | はんだ付け装置 | |
| JPS6442769U (de) | ||
| JPH02114165U (de) | ||
| JPS58171890A (ja) | プリント基板のはんだ付方法 | |
| JPH04243192A (ja) | はんだ付け方法 | |
| JPS6082266A (ja) | はんだ付け装置 | |
| JPS5961572U (ja) | 半田付装置 | |
| JPS63101174U (de) |