JPH0270859U - - Google Patents
Info
- Publication number
- JPH0270859U JPH0270859U JP15020888U JP15020888U JPH0270859U JP H0270859 U JPH0270859 U JP H0270859U JP 15020888 U JP15020888 U JP 15020888U JP 15020888 U JP15020888 U JP 15020888U JP H0270859 U JPH0270859 U JP H0270859U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- flux
- bump surface
- heating
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 230000004907 flux Effects 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 4
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000001179 sorption measurement Methods 0.000 claims 1
- 210000000078 claw Anatomy 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Description
第１図は本考案の一実施例を示すフローチヤー
ト、第２図は第１図に示す配線基板用半田付方法
の一使用例を示す斜視図、第３図は従来の一例を
示す斜視図、第４図は従来方法の欠点を示す側面
図である。
１……フラツクス塗布手段、２……赤外線ヒー
ター、３……噴流式半田槽、４……余剰半田除去
手段、５……フラツクス塗布手段、６……赤外線
ビーター、７……チエーンコンベア、８……配線
基板、９……チエーン、１０……爪、１１……ノ
ズル、１２……バンプ、１３……赤外線ヒーター
。
FIG. 1 is a flowchart showing an embodiment of the present invention, FIG. 2 is a perspective view showing an example of the use of the wiring board soldering method shown in FIG. 1, and FIG. 3 is a perspective view showing a conventional example. , FIG. 4 is a side view showing the drawbacks of the conventional method. DESCRIPTION OF SYMBOLS 1... Flux application means, 2... Infrared heater, 3... Jet solder bath, 4... Excess solder removal means, 5... Flux application means, 6... Infrared beater, 7... Chain conveyor, 8... ...Wiring board, 9...Chain, 10...Claw, 11...Nozzle, 12...Bump, 13...Infrared heater.
Claims (1)
ツクスを均一に塗布する第１のフラツクス塗布手
段、 (B) 前記配線基板を一定温度に予熱する予熱手
段、 (C) 前記バンプ面に半田をコーテイングするコ
ーテイング手段、 (D) 前記バンプ面の余分な半田を加熱し、溶融
させる余剰半田加熱手段、 (E) 溶融した余剰半田を吸着除去する余剰半田
除去手段、 (F) 前記バンプ面に前記フラツクスを均一に塗
布する第２のフラツクス塗布手段、 (G) 前記バンプ面を再度加熱し、前記半田を均
一に溶かす加熱手段、 とを含むことを特徴とする配線基板用半田付方法
。[Claims for Utility Model Registration] (A) A first flux application means for uniformly applying flux to the external connection bump surface on the wiring board surface; (B) Preheating means for preheating the wiring board to a constant temperature; (C) coating means for coating the bump surface with solder; (D) surplus solder heating means for heating and melting excess solder on the bump surface; (E) surplus solder removal means for removing the melted surplus solder by adsorption. (F) a second flux applying means for uniformly applying the flux to the bump surface; (G) a heating means for heating the bump surface again to uniformly melt the solder. Soldering method for wiring boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15020888U JPH0270859U (en) | 1988-11-17 | 1988-11-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15020888U JPH0270859U (en) | 1988-11-17 | 1988-11-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0270859U true JPH0270859U (en) | 1990-05-30 |
Family
ID=31423142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15020888U Pending JPH0270859U (en) | 1988-11-17 | 1988-11-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0270859U (en) |
-
1988
- 1988-11-17 JP JP15020888U patent/JPH0270859U/ja active Pending
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