JPH0267788A - Mounting of semiconductor device - Google Patents
Mounting of semiconductor deviceInfo
- Publication number
- JPH0267788A JPH0267788A JP22016388A JP22016388A JPH0267788A JP H0267788 A JPH0267788 A JP H0267788A JP 22016388 A JP22016388 A JP 22016388A JP 22016388 A JP22016388 A JP 22016388A JP H0267788 A JPH0267788 A JP H0267788A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- circuit board
- metal tape
- mounting
- pasted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 10
- 229910000679 solder Inorganic materials 0.000 abstract description 5
- 239000011347 resin Substances 0.000 abstract description 4
- 229920005989 resin Polymers 0.000 abstract description 4
- 230000008646 thermal stress Effects 0.000 abstract description 3
- 230000035882 stress Effects 0.000 abstract description 2
- 238000005476 soldering Methods 0.000 abstract 1
- 230000001678 irradiating effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体装置のプリント基板上への実装方法に
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for mounting a semiconductor device on a printed circuit board.
従来、この種の半導体装置の実装方法は、第３図に示す
ようにプリント基板３上に半導体装置２を配置し、リー
ド線４と基板の導体パターンとを接続するのに、上方よ
り赤外線等を照射しハンダ５を溶融して行なう方法が取
られている（赤外線リフロー）。Conventionally, in the mounting method of this type of semiconductor device, the semiconductor device 2 is placed on a printed circuit board 3 as shown in FIG. A method has been adopted in which the solder 5 is melted by irradiating it (infrared reflow).
上述した従来の実装方法では、赤外線リフローを用いた
場合、半導体装置のパッケージの厚さが薄いとりフロー
時に加わる熱ストレスにより樹脂クラックの発生が起る
という欠点があった。またこのストレスによるクラック
の発生は半導体装置の耐湿性の低下の原因となる。The above-described conventional mounting method has a drawback that when infrared reflow is used, resin cracks occur due to thermal stress applied during reflow since the package of the semiconductor device is thin. Furthermore, the occurrence of cracks due to this stress causes a decrease in the moisture resistance of the semiconductor device.
本発明は、半導体装置のプリント基板上への実装方法に
おいて、プリント基板上に半導体装置を一面が接するよ
うに配置し、他面上に金属シールを貼付して赤外線リフ
ローを行なうことを特徴とする。The present invention is a method for mounting a semiconductor device on a printed circuit board, which is characterized by arranging the semiconductor device on the printed circuit board so that one side is in contact with the other, pasting a metal seal on the other side, and performing infrared reflow. .
次に本発明について図面を用いて説明する。第１図は本
発明の一実施例の斜視図であり、第２図は第１図のＡ−
Ａ’断面図である。まず、プリント基板３に凹部を設は
半導体装置の背面を表にして置き、その上に金属テープ
１を貼付する。次に上方より赤外線を照射してハンダ付
けする。この方法によりハンダリフロー等の熱源からの
距離を広げ、かつ金属テープ１によって熱を反射させる
。上記の方法により半導体パッケージに対するる熱スト
レスの発生を低減できる。Next, the present invention will be explained using the drawings. FIG. 1 is a perspective view of an embodiment of the present invention, and FIG. 2 is a perspective view of an embodiment of the present invention.
It is an A' sectional view. First, a recess is provided in the printed circuit board 3, a semiconductor device is placed with its back side facing up, and the metal tape 1 is pasted thereon. Next, solder is applied by irradiating infrared light from above. This method increases the distance from the heat source such as solder reflow, and allows the metal tape 1 to reflect the heat. The above method can reduce the occurrence of thermal stress on the semiconductor package.
上記実施例では金属テープを用いた場合を説明したが、
金属テープのかわりに熱を反射させる金属板でも何らさ
しつかえない。また、プリント基板に四部を設けて、そ
こへ半導体装置を配置したが必ずしも凹部を設ける必要
はない。In the above embodiment, a case was explained in which a metal tape was used.
A metal plate that reflects heat can be used instead of metal tape. Further, although the printed circuit board has four parts and the semiconductor device is placed there, it is not necessary to provide the recessed parts.
以上説明したように本発明は、半導体装置を基板に対し
て一面を接するように配置し、他面上に金属シールを貼
付することにより樹脂の温度上昇をおさえ、熱膨張によ
りストレスの発生、樹脂クラックの発生を防止すること
ができる。また樹脂封止型半導体装置の実装時における
耐湿性を改善できる。As explained above, the present invention suppresses the temperature rise of the resin by arranging the semiconductor device so that one side is in contact with the substrate and pasting a metal seal on the other side. It is possible to prevent the occurrence of cracks. Moreover, the moisture resistance during mounting of a resin-sealed semiconductor device can be improved.
第１図は本発明の一実施例の斜視図、第２図は第１図の
Ａ−Ａ’線断面図、第３図は従来例の断面図である。
１・・・金属テープ、２・・・半導体装置、３・・・プ
リント基板、４・・・リード線、５・・・ハンダ。FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a sectional view taken along the line AA' in FIG. 1, and FIG. 3 is a sectional view of a conventional example. DESCRIPTION OF SYMBOLS 1... Metal tape, 2... Semiconductor device, 3... Printed circuit board, 4... Lead wire, 5... Solder.
Claims (1)
板上に半導体装置を一面が接するように配置し、他面上
に金属シールを貼付したことを特徴とする半導体装置の
実装方法。1. A method for mounting a semiconductor device on a printed circuit board, characterized in that the semiconductor device is placed on the board so that one side is in contact with the other side, and a metal seal is affixed on the other side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22016388A JPH0267788A (en) | 1988-09-01 | 1988-09-01 | Mounting of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22016388A JPH0267788A (en) | 1988-09-01 | 1988-09-01 | Mounting of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0267788A true JPH0267788A (en) | 1990-03-07 |
Family
ID=16746874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22016388A Pending JPH0267788A (en) | 1988-09-01 | 1988-09-01 | Mounting of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0267788A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010178667A (en) * | 2009-02-05 | 2010-08-19 | Nissin Frozen Foods Co Ltd | Frozen seasoning liquid pack, frozen noodle containing the same, and method for producing the frozen noodle |
-
1988
- 1988-09-01 JP JP22016388A patent/JPH0267788A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010178667A (en) * | 2009-02-05 | 2010-08-19 | Nissin Frozen Foods Co Ltd | Frozen seasoning liquid pack, frozen noodle containing the same, and method for producing the frozen noodle |
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