JPH0266131A - 高強度高導電性銅基合金 - Google Patents
高強度高導電性銅基合金Info
- Publication number
- JPH0266131A JPH0266131A JP21460388A JP21460388A JPH0266131A JP H0266131 A JPH0266131 A JP H0266131A JP 21460388 A JP21460388 A JP 21460388A JP 21460388 A JP21460388 A JP 21460388A JP H0266131 A JPH0266131 A JP H0266131A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- strength
- copper
- based alloy
- content
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 45
- 239000000956 alloy Substances 0.000 title claims abstract description 45
- 229910052790 beryllium Inorganic materials 0.000 claims abstract description 10
- 229910052718 tin Inorganic materials 0.000 claims abstract description 10
- 239000012535 impurity Substances 0.000 claims abstract description 7
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 6
- 229910052742 iron Inorganic materials 0.000 claims abstract description 4
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 4
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 3
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 3
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 3
- 239000010949 copper Substances 0.000 claims description 35
- 229910052802 copper Inorganic materials 0.000 claims description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 29
- 229910052717 sulfur Inorganic materials 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 15
- 229910052759 nickel Inorganic materials 0.000 abstract description 7
- 229910000881 Cu alloy Inorganic materials 0.000 abstract 2
- 238000000280 densification Methods 0.000 abstract 1
- 230000007423 decrease Effects 0.000 description 11
- 238000005452 bending Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- 229910052799 carbon Inorganic materials 0.000 description 6
- 238000005266 casting Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005098 hot rolling Methods 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21460388A JPH0266131A (ja) | 1988-08-29 | 1988-08-29 | 高強度高導電性銅基合金 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21460388A JPH0266131A (ja) | 1988-08-29 | 1988-08-29 | 高強度高導電性銅基合金 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0266131A true JPH0266131A (ja) | 1990-03-06 |
| JPH0565571B2 JPH0565571B2 (enrdf_load_stackoverflow) | 1993-09-20 |
Family
ID=16658447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21460388A Granted JPH0266131A (ja) | 1988-08-29 | 1988-08-29 | 高強度高導電性銅基合金 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0266131A (enrdf_load_stackoverflow) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2650443A1 (fr) * | 1989-07-25 | 1991-02-01 | Mitsubishi Shindo Kk | Connecteur en alliage a base de cuivre pour dispositifs electriques |
| JPH0417214A (ja) * | 1990-05-10 | 1992-01-22 | Sumitomo Electric Ind Ltd | ハーネス用電線導体 |
| US5149917A (en) * | 1990-05-10 | 1992-09-22 | Sumitomo Electric Industries, Ltd. | Wire conductor for harness |
| US5508001A (en) * | 1992-11-13 | 1996-04-16 | Mitsubishi Sindoh Co., Ltd. | Copper based alloy for electrical and electronic parts excellent in hot workability and blankability |
| US5993574A (en) * | 1996-10-28 | 1999-11-30 | Brush Wellman, Inc. | Lean, high conductivity, relaxation-resistant beryllium-nickel-copper alloys |
| CN1065920C (zh) * | 1998-11-26 | 2001-05-16 | 昆明市有色金属铸造厂 | 一种锌铬钛镁铝青铜铸造合金 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61170533A (ja) * | 1985-01-22 | 1986-08-01 | Ngk Insulators Ltd | 導電ばね材料 |
| JPS63125633A (ja) * | 1987-07-16 | 1988-05-28 | Nippon Mining Co Ltd | 高力高導電銅合金 |
-
1988
- 1988-08-29 JP JP21460388A patent/JPH0266131A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61170533A (ja) * | 1985-01-22 | 1986-08-01 | Ngk Insulators Ltd | 導電ばね材料 |
| JPS63125633A (ja) * | 1987-07-16 | 1988-05-28 | Nippon Mining Co Ltd | 高力高導電銅合金 |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2650443A1 (fr) * | 1989-07-25 | 1991-02-01 | Mitsubishi Shindo Kk | Connecteur en alliage a base de cuivre pour dispositifs electriques |
| JPH0417214A (ja) * | 1990-05-10 | 1992-01-22 | Sumitomo Electric Ind Ltd | ハーネス用電線導体 |
| US5149917A (en) * | 1990-05-10 | 1992-09-22 | Sumitomo Electric Industries, Ltd. | Wire conductor for harness |
| US5508001A (en) * | 1992-11-13 | 1996-04-16 | Mitsubishi Sindoh Co., Ltd. | Copper based alloy for electrical and electronic parts excellent in hot workability and blankability |
| US5993574A (en) * | 1996-10-28 | 1999-11-30 | Brush Wellman, Inc. | Lean, high conductivity, relaxation-resistant beryllium-nickel-copper alloys |
| US6001196A (en) * | 1996-10-28 | 1999-12-14 | Brush Wellman, Inc. | Lean, high conductivity, relaxation-resistant beryllium-nickel-copper alloys |
| CN1065920C (zh) * | 1998-11-26 | 2001-05-16 | 昆明市有色金属铸造厂 | 一种锌铬钛镁铝青铜铸造合金 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0565571B2 (enrdf_load_stackoverflow) | 1993-09-20 |
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