JPH0263530U - - Google Patents
Info
- Publication number
- JPH0263530U JPH0263530U JP14333788U JP14333788U JPH0263530U JP H0263530 U JPH0263530 U JP H0263530U JP 14333788 U JP14333788 U JP 14333788U JP 14333788 U JP14333788 U JP 14333788U JP H0263530 U JPH0263530 U JP H0263530U
- Authority
- JP
- Japan
- Prior art keywords
- mask
- deflection
- amount
- wafer
- print gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000001179 sorption measurement Methods 0.000 description 1
Description
第１図は本考案に係る半導体製造装置の一実施
例を示す要部側断面図、第２図と第３図は従来の
半導体製造装置の一具体例を示す要部側断面図と
その動作時の側断面図である。
２…吸着ステージ、３…半導体ウエーハ、４…
露光マスク、７…非接触距離検出器、Ａ，Ｂ，Ｃ
…複数の位置。
FIG. 1 is a side sectional view of a main part showing an embodiment of a semiconductor manufacturing device according to the present invention, and FIGS. 2 and 3 are side sectional views of main parts showing a specific example of a conventional semiconductor manufacturing device and its operation. FIG. 2...Adsorption stage, 3...Semiconductor wafer, 4...
Exposure mask, 7... Non-contact distance detector, A, B, C
…Multiple positions.
Claims (1)
に所定のプリントギヤツプを介して露光マスクを
位置決め・配置し、上記ギヤツプ間を負圧吸引し
て露光マスクをたわませ、半導体ウエーハに上記
マスクを密着させて露光する半導体製造装置にお
いて、 上記マスクのたわみ量を複数の位置で測定する
非接触距離検出器と、上記検出器によつて測定さ
れたマスクのたわみ量を設定値と比較し、上記プ
リントギヤツプを可変して上記たわみ量を設定値
にするプリントギヤツプ可変手段とを付設したこ
とを特徴とする半導体製造装置。[Scope of Claim for Utility Model Registration] An exposure mask is positioned and placed above a semiconductor wafer placed on a suction stage through a predetermined print gap, and the exposure mask is deflected by suctioning negative pressure between the gaps. In semiconductor manufacturing equipment that exposes a wafer with the mask in close contact with the wafer, a non-contact distance detector is provided to measure the amount of deflection of the mask at multiple positions, and the amount of deflection of the mask measured by the detector is set to a set value. A semiconductor manufacturing apparatus, as compared to the above, further comprising print gap variable means for varying the print gap to set the deflection amount to a set value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14333788U JPH0263530U (en) | 1988-10-31 | 1988-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14333788U JPH0263530U (en) | 1988-10-31 | 1988-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0263530U true JPH0263530U (en) | 1990-05-11 |
Family
ID=31410068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14333788U Pending JPH0263530U (en) | 1988-10-31 | 1988-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0263530U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006350192A (en) * | 2005-06-20 | 2006-12-28 | Ono Sokki Co Ltd | Alignment device of exposure machine and alignment method of exposure machine |
| JP2013120789A (en) * | 2011-12-06 | 2013-06-17 | National Institute Of Advanced Industrial & Technology | Exposure system |
-
1988
- 1988-10-31 JP JP14333788U patent/JPH0263530U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006350192A (en) * | 2005-06-20 | 2006-12-28 | Ono Sokki Co Ltd | Alignment device of exposure machine and alignment method of exposure machine |
| JP2013120789A (en) * | 2011-12-06 | 2013-06-17 | National Institute Of Advanced Industrial & Technology | Exposure system |
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