JPH01171034U - - Google Patents
Info
- Publication number
- JPH01171034U JPH01171034U JP6854788U JP6854788U JPH01171034U JP H01171034 U JPH01171034 U JP H01171034U JP 6854788 U JP6854788 U JP 6854788U JP 6854788 U JP6854788 U JP 6854788U JP H01171034 U JPH01171034 U JP H01171034U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- inspection device
- probe
- nozzle
- stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 claims description 4
- 239000000523 sample Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000007921 spray Substances 0.000 claims 1
- 239000008188 pellet Substances 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図はこの考案の一実施例の検査装置の要部
拡大断面図である。第２図は従来の検査装置の要
部拡大断面図である。
１……ステージ、２……半導体ウエーハ、３…
…半導体ペレツト、４……バンプ電極、５……プ
ローブカード、６……探針、７……ノズル。
FIG. 1 is an enlarged sectional view of a main part of an inspection apparatus according to an embodiment of the invention. FIG. 2 is an enlarged sectional view of a main part of a conventional inspection device. 1...Stage, 2...Semiconductor wafer, 3...
... semiconductor pellet, 4 ... bump electrode, 5 ... probe card, 6 ... probe, 7 ... nozzle.
Claims (1)
導体ウエーハの電極に接触する探針を有するプロ
ーブカードとを含む検査装置において、 前記プローブカードの探針の先端部分に向かつ
て不活性気体を吹き付けるノズルを設けたことを
特徴とする検査装置。[Scope of Claim for Utility Model Registration] In an inspection device including a stage that holds a semiconductor wafer by suction and a probe card having a probe that contacts an electrode of the semiconductor wafer, An inspection device characterized by being equipped with a nozzle that sprays active gas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6854788U JPH01171034U (en) | 1988-05-24 | 1988-05-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6854788U JPH01171034U (en) | 1988-05-24 | 1988-05-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01171034U true JPH01171034U (en) | 1989-12-04 |
Family
ID=31293858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6854788U Pending JPH01171034U (en) | 1988-05-24 | 1988-05-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01171034U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07273157A (en) * | 1994-03-30 | 1995-10-20 | Hitachi Ltd | Method and equipment for inspecting semiconductor device |
| JP2000216205A (en) * | 1999-01-22 | 2000-08-04 | Matsushita Electric Ind Co Ltd | Checking device and method using the same |
-
1988
- 1988-05-24 JP JP6854788U patent/JPH01171034U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07273157A (en) * | 1994-03-30 | 1995-10-20 | Hitachi Ltd | Method and equipment for inspecting semiconductor device |
| JP2000216205A (en) * | 1999-01-22 | 2000-08-04 | Matsushita Electric Ind Co Ltd | Checking device and method using the same |