JPS6322736U - - Google Patents
Info
- Publication number
- JPS6322736U JPS6322736U JP11721986U JP11721986U JPS6322736U JP S6322736 U JPS6322736 U JP S6322736U JP 11721986 U JP11721986 U JP 11721986U JP 11721986 U JP11721986 U JP 11721986U JP S6322736 U JPS6322736 U JP S6322736U
- Authority
- JP
- Japan
- Prior art keywords
- template
- lead frame
- resin sealing
- semiconductor manufacturing
- manufacturing equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000006073 displacement reaction Methods 0.000 description 1
Description
第１図は本考案に係る半導体製造装置の樹脂封
止用装置を示す断面図、第２図は従来の半導体製
造装置の樹脂封止用装置を示す断面図、第３図は
その樹脂封止用装置による樹脂封止例を説明する
ための平面図である。
１……固定側の型板、２……可動側の型板、５
……ヒータ、１２……パーテイング面、１５……
リードフレーム、１５ａ……素子側面、２１……
渦電流式非接触変位計。
FIG. 1 is a sectional view showing a resin sealing device for a semiconductor manufacturing device according to the present invention, FIG. 2 is a sectional view showing a conventional resin sealing device for a semiconductor manufacturing device, and FIG. 3 is a sectional view showing the resin sealing device for a semiconductor manufacturing device according to the present invention. FIG. 3 is a plan view illustrating an example of resin sealing using a device for use. 1... Fixed side template, 2... Movable side template, 5
... Heater, 12 ... Parting surface, 15 ...
Lead frame, 15a...Element side, 21...
Eddy current type non-contact displacement meter.
Claims (1)
動側の型板のうち一方の型板上にリードフレーム
を保持し、このリードフレーム上の半導体素子を
樹脂封止する半導体製造装置の樹脂封止用装置に
おいて、移動中の前記型板を停止させるための距
離検出器を備え、この距離検出器によつて前記一
方の型板上のリードフレームの素子側面が前記他
方の型板のパーテイング面と同一の面上に位置付
けられたことを検出するように構成したことを特
徴とする半導体製造装置の樹脂封止用装置。 Resin sealing of semiconductor manufacturing equipment in which a lead frame is held on one of a stationary template and a movable template, each of which has a built-in heater, and semiconductor elements on the lead frame are sealed with resin. The device includes a distance detector for stopping the moving template, and the distance detector detects that the element side of the lead frame on the one template is aligned with the parting surface of the other template. 1. A resin sealing device for semiconductor manufacturing equipment, characterized in that it is configured to detect that the devices are positioned on the same surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11721986U JPS6322736U (en) | 1986-07-29 | 1986-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11721986U JPS6322736U (en) | 1986-07-29 | 1986-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6322736U true JPS6322736U (en) | 1988-02-15 |
Family
ID=31002530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11721986U Pending JPS6322736U (en) | 1986-07-29 | 1986-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6322736U (en) |
-
1986
- 1986-07-29 JP JP11721986U patent/JPS6322736U/ja active Pending
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