JPH0430725U - - Google Patents

Info

Publication number
JPH0430725U
JPH0430725U JP7183890U JP7183890U JPH0430725U JP H0430725 U JPH0430725 U JP H0430725U JP 7183890 U JP7183890 U JP 7183890U JP 7183890 U JP7183890 U JP 7183890U JP H0430725 U JPH0430725 U JP H0430725U
Authority
JP
Japan
Prior art keywords
alignment
matching
layer
matching pattern
deviation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7183890U
Other languages
Japanese (ja)
Other versions
JP2530950Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990071838U priority Critical patent/JP2530950Y2/en
Publication of JPH0430725U publication Critical patent/JPH0430725U/ja
Application granted granted Critical
Publication of JP2530950Y2 publication Critical patent/JP2530950Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図および第2図は本考案に係るアライメン
ト測定装置の一実施例を示す図であり、第1図は
アライメント測定パターンのマスクへの配置例を
示す図、第2図はアライメント測定パターンを示
す図、第3図は従来の合わせマークパターンを示
す図である。 10……マスクパターン、20……アライメン
ト測定パターン。
1 and 2 are diagrams showing one embodiment of the alignment measurement device according to the present invention, FIG. 1 is a diagram showing an example of arrangement of an alignment measurement pattern on a mask, and FIG. 2 is a diagram showing an example of arrangement of an alignment measurement pattern on a mask. The figure shown in FIG. 3 is a diagram showing a conventional alignment mark pattern. 10...mask pattern, 20... alignment measurement pattern.

Claims (1)

【実用新案登録請求の範囲】 各層のマスクに大きさの異なる矩形のアライメ
ント測定用合わせパターンおよび被合わせパター
ンを形成し、該合わせパターンと該被合わせパタ
ーンのずれによりマスク間のアライメントずれを
測定するアライメント測定装置において、 各層のマスクに全層の前記合わせパターンおよ
び被合わせパターンを所定の順序により並べて形
成して、各層間のアライメントずれを測定するよ
うに構成されたことを特徴とするアライメント測
定装置。
[Claims for Utility Model Registration] Rectangular matching patterns and matching patterns for alignment measurement of different sizes are formed on the masks of each layer, and the alignment deviation between the masks is measured based on the deviation between the matching pattern and the matching pattern. An alignment measuring device, characterized in that the alignment measuring device is configured to form the matching pattern and the matching pattern of all layers in a predetermined order on a mask of each layer, and measure the alignment deviation between each layer. .
JP1990071838U 1990-07-05 1990-07-05 Substrate alignment pattern Expired - Lifetime JP2530950Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990071838U JP2530950Y2 (en) 1990-07-05 1990-07-05 Substrate alignment pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990071838U JP2530950Y2 (en) 1990-07-05 1990-07-05 Substrate alignment pattern

Publications (2)

Publication Number Publication Date
JPH0430725U true JPH0430725U (en) 1992-03-12
JP2530950Y2 JP2530950Y2 (en) 1997-04-02

Family

ID=31609231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990071838U Expired - Lifetime JP2530950Y2 (en) 1990-07-05 1990-07-05 Substrate alignment pattern

Country Status (1)

Country Link
JP (1) JP2530950Y2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5382173A (en) * 1976-12-27 1978-07-20 Fujitsu Ltd Positioning method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5382173A (en) * 1976-12-27 1978-07-20 Fujitsu Ltd Positioning method

Also Published As

Publication number Publication date
JP2530950Y2 (en) 1997-04-02

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term