JPH0256471U - - Google Patents
Info
- Publication number
- JPH0256471U JPH0256471U JP13565488U JP13565488U JPH0256471U JP H0256471 U JPH0256471 U JP H0256471U JP 13565488 U JP13565488 U JP 13565488U JP 13565488 U JP13565488 U JP 13565488U JP H0256471 U JPH0256471 U JP H0256471U
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- board
- trimming
- function
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009966 trimming Methods 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 2
- 239000012212 insulator Substances 0.000 claims 1
Description
第１図は、本考案の一実施例を示す表面図およ
び裏面図である。第２図は、本考案の他の一実施
例を示す表面図および裏面図である。
１……両面基板、２ａ，２ｂ……リードフレー
ム取付け用電極、２ｃ，２ｄ，２ｅ……導電パタ
ーン、３，３ａ，３ｂ……スルーホール、４……
ストライブライン、５，５ａ，５ｂ……電極、６
……空白部分。
FIG. 1 is a front view and a back view showing an embodiment of the present invention. FIG. 2 is a front view and a back view showing another embodiment of the present invention. 1...Double-sided board, 2a, 2b...Electrode for lead frame attachment, 2c, 2d, 2e...Conductive pattern, 3, 3a, 3b...Through hole, 4...
Stripe line, 5, 5a, 5b...electrode, 6
...Blank area.
Claims (1)
付け用電極を有し、レーザ加工により回路要素の
機能調節を行なうためのフアンクシヨントリミン
グ用両面基板において、前記リードフレーム取付
け用電極を配置した部分に隣接して外方周辺に余
白部分を設け、調節される抵抗がない方の基板面
上のリードフレーム取付け用電極から導電パター
ンを前記余白部分に引き出し、引き出した導電パ
ターンの一部に、基板の反対側の面に電極を引き
出すスルーホールを設けたことを特徴とするフア
ンクシヨンレーザトリミング用両面基板。 A double-sided board for function trimming, which has electrodes for attaching lead frames on both sides of a substrate made of an insulator, and is used for function trimming of circuit elements by laser processing, adjacent to the part where the electrodes for attaching lead frames are arranged. A blank space is provided around the outside of the board, and a conductive pattern is drawn out from the lead frame mounting electrode on the side of the board that does not have the resistance to be adjusted into the blank space. A double-sided substrate for function laser trimming, characterized by having through-holes on the side surface for drawing out electrodes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13565488U JPH0256471U (en) | 1988-10-18 | 1988-10-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13565488U JPH0256471U (en) | 1988-10-18 | 1988-10-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0256471U true JPH0256471U (en) | 1990-04-24 |
Family
ID=31395475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13565488U Pending JPH0256471U (en) | 1988-10-18 | 1988-10-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0256471U (en) |
-
1988
- 1988-10-18 JP JP13565488U patent/JPH0256471U/ja active Pending