JPH0255938B2 - - Google Patents
Info
- Publication number
- JPH0255938B2 JPH0255938B2 JP57027132A JP2713282A JPH0255938B2 JP H0255938 B2 JPH0255938 B2 JP H0255938B2 JP 57027132 A JP57027132 A JP 57027132A JP 2713282 A JP2713282 A JP 2713282A JP H0255938 B2 JPH0255938 B2 JP H0255938B2
- Authority
- JP
- Japan
- Prior art keywords
- single crystal
- cutting
- coating
- oxide
- oxide single
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000013078 crystal Substances 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 21
- 238000000576 coating method Methods 0.000 claims description 17
- 239000011248 coating agent Substances 0.000 claims description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229910044991 metal oxide Inorganic materials 0.000 claims description 4
- 150000004706 metal oxides Chemical class 0.000 claims description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 claims description 3
- ZPDRQAVGXHVGTB-UHFFFAOYSA-N gallium;gadolinium(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Gd+3] ZPDRQAVGXHVGTB-UHFFFAOYSA-N 0.000 claims description 2
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 9
- 229910003460 diamond Inorganic materials 0.000 description 6
- 239000010432 diamond Substances 0.000 description 6
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- UIWYJDYFSGRHKR-UHFFFAOYSA-N gadolinium atom Chemical compound [Gd] UIWYJDYFSGRHKR-UHFFFAOYSA-N 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2713282A JPS58145408A (ja) | 1982-02-22 | 1982-02-22 | 単結晶の切断方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2713282A JPS58145408A (ja) | 1982-02-22 | 1982-02-22 | 単結晶の切断方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58145408A JPS58145408A (ja) | 1983-08-30 |
| JPH0255938B2 true JPH0255938B2 (no) | 1990-11-28 |
Family
ID=12212520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2713282A Granted JPS58145408A (ja) | 1982-02-22 | 1982-02-22 | 単結晶の切断方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58145408A (no) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4989477A (no) * | 1972-12-27 | 1974-08-27 | ||
| JPS5632369A (en) * | 1979-06-29 | 1981-04-01 | Minnesota Mining & Mfg | Manufacture of abrasive ore* abrasive ore* claddwork abrasive product* abrasive wheel and nonwoven abrasive product |
-
1982
- 1982-02-22 JP JP2713282A patent/JPS58145408A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4989477A (no) * | 1972-12-27 | 1974-08-27 | ||
| JPS5632369A (en) * | 1979-06-29 | 1981-04-01 | Minnesota Mining & Mfg | Manufacture of abrasive ore* abrasive ore* claddwork abrasive product* abrasive wheel and nonwoven abrasive product |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58145408A (ja) | 1983-08-30 |
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