JPH025552Y2 - - Google Patents
Info
- Publication number
- JPH025552Y2 JPH025552Y2 JP7256081U JP7256081U JPH025552Y2 JP H025552 Y2 JPH025552 Y2 JP H025552Y2 JP 7256081 U JP7256081 U JP 7256081U JP 7256081 U JP7256081 U JP 7256081U JP H025552 Y2 JPH025552 Y2 JP H025552Y2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- conductive film
- chip component
- conductive
- figures
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7256081U JPH025552Y2 (instruction) | 1981-05-21 | 1981-05-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7256081U JPH025552Y2 (instruction) | 1981-05-21 | 1981-05-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57186070U JPS57186070U (instruction) | 1982-11-26 |
| JPH025552Y2 true JPH025552Y2 (instruction) | 1990-02-09 |
Family
ID=29868345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7256081U Expired JPH025552Y2 (instruction) | 1981-05-21 | 1981-05-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH025552Y2 (instruction) |
-
1981
- 1981-05-21 JP JP7256081U patent/JPH025552Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57186070U (instruction) | 1982-11-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH025552Y2 (instruction) | ||
| US4273803A (en) | Process for covering or coating electrical components | |
| JPS6038292Y2 (ja) | プリント基板 | |
| JPS5882555A (ja) | ２つ以上の集積回路を収納するボツクスの製造方法 | |
| JPS6214497A (ja) | 印刷配線板の製造方法 | |
| JPS6120734Y2 (instruction) | ||
| JPS6339969Y2 (instruction) | ||
| JPS6120792Y2 (instruction) | ||
| JPS59145592A (ja) | 印刷配線基板への電子部品の取付法 | |
| JPS5824459Y2 (ja) | 電気部品装着基板 | |
| JP2002374060A (ja) | 電子回路板 | |
| JPS5843803Y2 (ja) | プリント配線基板の支持装置 | |
| JPS5940787Y2 (ja) | 電子部品接続用の半田電極構造 | |
| JP2595947B2 (ja) | 可塑性樹脂コーテイング用ｉｃパツケージ | |
| JPH0625006Y2 (ja) | 回路基板 | |
| JPH0214194Y2 (instruction) | ||
| JPH0230921Y2 (instruction) | ||
| JPH0445251Y2 (instruction) | ||
| JPS5849659Y2 (ja) | プリント配線基板 | |
| JPS5844602Y2 (ja) | プリント配線基板 | |
| JPH0525768U (ja) | フラツクスのすいあがり防止構造 | |
| JPH0729660Y2 (ja) | 回路装置 | |
| JPH0749826Y2 (ja) | チップ部品の半田付構造 | |
| JPH06314873A (ja) | プリント配線板 | |
| JPS6339116B2 (instruction) |