JPH025536Y2 - - Google Patents

Info

Publication number
JPH025536Y2
JPH025536Y2 JP1984185694U JP18569484U JPH025536Y2 JP H025536 Y2 JPH025536 Y2 JP H025536Y2 JP 1984185694 U JP1984185694 U JP 1984185694U JP 18569484 U JP18569484 U JP 18569484U JP H025536 Y2 JPH025536 Y2 JP H025536Y2
Authority
JP
Japan
Prior art keywords
lead frame
bonding
mounting table
elastic material
ultrasonic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984185694U
Other languages
English (en)
Japanese (ja)
Other versions
JPS61100136U (US20030199744A1-20031023-C00003.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984185694U priority Critical patent/JPH025536Y2/ja
Publication of JPS61100136U publication Critical patent/JPS61100136U/ja
Application granted granted Critical
Publication of JPH025536Y2 publication Critical patent/JPH025536Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1984185694U 1984-12-07 1984-12-07 Expired JPH025536Y2 (US20030199744A1-20031023-C00003.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984185694U JPH025536Y2 (US20030199744A1-20031023-C00003.png) 1984-12-07 1984-12-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984185694U JPH025536Y2 (US20030199744A1-20031023-C00003.png) 1984-12-07 1984-12-07

Publications (2)

Publication Number Publication Date
JPS61100136U JPS61100136U (US20030199744A1-20031023-C00003.png) 1986-06-26
JPH025536Y2 true JPH025536Y2 (US20030199744A1-20031023-C00003.png) 1990-02-09

Family

ID=30743159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984185694U Expired JPH025536Y2 (US20030199744A1-20031023-C00003.png) 1984-12-07 1984-12-07

Country Status (1)

Country Link
JP (1) JPH025536Y2 (US20030199744A1-20031023-C00003.png)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4604384B2 (ja) * 2001-04-16 2011-01-05 サンケン電気株式会社 回路基板実装体の実装方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS542370B2 (US20030199744A1-20031023-C00003.png) * 1972-10-20 1979-02-06
JPS57154848A (en) * 1981-03-20 1982-09-24 Hitachi Ltd Assembling device for semiconductor
JPS57194539A (en) * 1981-05-27 1982-11-30 Hitachi Ltd Pressing structure for lead frame

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53159271U (US20030199744A1-20031023-C00003.png) * 1977-05-20 1978-12-13
JPS542370U (US20030199744A1-20031023-C00003.png) * 1977-06-08 1979-01-09

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS542370B2 (US20030199744A1-20031023-C00003.png) * 1972-10-20 1979-02-06
JPS57154848A (en) * 1981-03-20 1982-09-24 Hitachi Ltd Assembling device for semiconductor
JPS57194539A (en) * 1981-05-27 1982-11-30 Hitachi Ltd Pressing structure for lead frame

Also Published As

Publication number Publication date
JPS61100136U (US20030199744A1-20031023-C00003.png) 1986-06-26

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