JPH0254666B2 - - Google Patents

Info

Publication number
JPH0254666B2
JPH0254666B2 JP59114018A JP11401884A JPH0254666B2 JP H0254666 B2 JPH0254666 B2 JP H0254666B2 JP 59114018 A JP59114018 A JP 59114018A JP 11401884 A JP11401884 A JP 11401884A JP H0254666 B2 JPH0254666 B2 JP H0254666B2
Authority
JP
Japan
Prior art keywords
resin
support plate
hole
resin coating
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59114018A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60257529A (ja
Inventor
Minehide Totokawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP59114018A priority Critical patent/JPS60257529A/ja
Publication of JPS60257529A publication Critical patent/JPS60257529A/ja
Publication of JPH0254666B2 publication Critical patent/JPH0254666B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/016—
    • H10W72/01515—
    • H10W72/075—
    • H10W72/5449—
    • H10W74/00—
    • H10W74/10—
    • H10W90/756—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59114018A 1984-06-04 1984-06-04 樹脂封止型半導体装置の製造方法 Granted JPS60257529A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59114018A JPS60257529A (ja) 1984-06-04 1984-06-04 樹脂封止型半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59114018A JPS60257529A (ja) 1984-06-04 1984-06-04 樹脂封止型半導体装置の製造方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP8942189A Division JPH01302728A (ja) 1989-04-07 1989-04-07 樹脂封止型半導体装置の製造方法
JP8942289A Division JPH01302729A (ja) 1989-04-07 1989-04-07 樹脂封止型半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS60257529A JPS60257529A (ja) 1985-12-19
JPH0254666B2 true JPH0254666B2 (enExample) 1990-11-22

Family

ID=14626985

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59114018A Granted JPS60257529A (ja) 1984-06-04 1984-06-04 樹脂封止型半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS60257529A (enExample)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60169843U (ja) * 1984-04-19 1985-11-11 日本電気株式会社 絶縁型半導体装置

Also Published As

Publication number Publication date
JPS60257529A (ja) 1985-12-19

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees