JPS60257529A - 樹脂封止型半導体装置の製造方法 - Google Patents

樹脂封止型半導体装置の製造方法

Info

Publication number
JPS60257529A
JPS60257529A JP59114018A JP11401884A JPS60257529A JP S60257529 A JPS60257529 A JP S60257529A JP 59114018 A JP59114018 A JP 59114018A JP 11401884 A JP11401884 A JP 11401884A JP S60257529 A JPS60257529 A JP S60257529A
Authority
JP
Japan
Prior art keywords
resin
space
support plate
resin coating
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59114018A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0254666B2 (enExample
Inventor
Minehide Totokawa
都外川　峯秀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP59114018A priority Critical patent/JPS60257529A/ja
Publication of JPS60257529A publication Critical patent/JPS60257529A/ja
Publication of JPH0254666B2 publication Critical patent/JPH0254666B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/016—
    • H10W72/01515—
    • H10W72/075—
    • H10W72/5449—
    • H10W74/00—
    • H10W74/10—
    • H10W90/756—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59114018A 1984-06-04 1984-06-04 樹脂封止型半導体装置の製造方法 Granted JPS60257529A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59114018A JPS60257529A (ja) 1984-06-04 1984-06-04 樹脂封止型半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59114018A JPS60257529A (ja) 1984-06-04 1984-06-04 樹脂封止型半導体装置の製造方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP8942189A Division JPH01302728A (ja) 1989-04-07 1989-04-07 樹脂封止型半導体装置の製造方法
JP8942289A Division JPH01302729A (ja) 1989-04-07 1989-04-07 樹脂封止型半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS60257529A true JPS60257529A (ja) 1985-12-19
JPH0254666B2 JPH0254666B2 (enExample) 1990-11-22

Family

ID=14626985

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59114018A Granted JPS60257529A (ja) 1984-06-04 1984-06-04 樹脂封止型半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS60257529A (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60169843U (ja) * 1984-04-19 1985-11-11 日本電気株式会社 絶縁型半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60169843U (ja) * 1984-04-19 1985-11-11 日本電気株式会社 絶縁型半導体装置

Also Published As

Publication number Publication date
JPH0254666B2 (enExample) 1990-11-22

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees