JPH0254658B2 - - Google Patents

Info

Publication number
JPH0254658B2
JPH0254658B2 JP11151882A JP11151882A JPH0254658B2 JP H0254658 B2 JPH0254658 B2 JP H0254658B2 JP 11151882 A JP11151882 A JP 11151882A JP 11151882 A JP11151882 A JP 11151882A JP H0254658 B2 JPH0254658 B2 JP H0254658B2
Authority
JP
Japan
Prior art keywords
aluminum
semiconductor substrate
ultrafine particles
ultrafine
deposited
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11151882A
Other languages
English (en)
Japanese (ja)
Other versions
JPS593952A (ja
Inventor
Takashi Yahano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP11151882A priority Critical patent/JPS593952A/ja
Publication of JPS593952A publication Critical patent/JPS593952A/ja
Publication of JPH0254658B2 publication Critical patent/JPH0254658B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
JP11151882A 1982-06-30 1982-06-30 アルミニウム配線層の形成方法 Granted JPS593952A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11151882A JPS593952A (ja) 1982-06-30 1982-06-30 アルミニウム配線層の形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11151882A JPS593952A (ja) 1982-06-30 1982-06-30 アルミニウム配線層の形成方法

Publications (2)

Publication Number Publication Date
JPS593952A JPS593952A (ja) 1984-01-10
JPH0254658B2 true JPH0254658B2 (enExample) 1990-11-22

Family

ID=14563346

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11151882A Granted JPS593952A (ja) 1982-06-30 1982-06-30 アルミニウム配線層の形成方法

Country Status (1)

Country Link
JP (1) JPS593952A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63208244A (ja) * 1987-02-24 1988-08-29 Nec Corp 半導体装置の製造方法
JPH01298169A (ja) * 1988-05-27 1989-12-01 Tokyo Electron Ltd 膜形成方法
JPH1197392A (ja) * 1997-09-16 1999-04-09 Ebara Corp 微細窪みの充填方法及び装置
US6730596B1 (en) 1999-10-15 2004-05-04 Ebara Corporation Method of and apparatus for forming interconnection
JP4578755B2 (ja) * 2000-05-02 2010-11-10 日揮触媒化成株式会社 集積回路の製造方法
EP1597194A4 (en) * 2003-02-07 2007-09-26 Nano Cluster Devices Ltd TEMPLATE CLUSTER MOUNTED WIRES

Also Published As

Publication number Publication date
JPS593952A (ja) 1984-01-10

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