JPH0252444U - - Google Patents

Info

Publication number
JPH0252444U
JPH0252444U JP1988132232U JP13223288U JPH0252444U JP H0252444 U JPH0252444 U JP H0252444U JP 1988132232 U JP1988132232 U JP 1988132232U JP 13223288 U JP13223288 U JP 13223288U JP H0252444 U JPH0252444 U JP H0252444U
Authority
JP
Japan
Prior art keywords
hermetically sealed
base
layer made
metal
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988132232U
Other languages
English (en)
Other versions
JPH0741159Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988132232U priority Critical patent/JPH0741159Y2/ja
Priority to US07/415,777 priority patent/US4941582A/en
Publication of JPH0252444U publication Critical patent/JPH0252444U/ja
Application granted granted Critical
Publication of JPH0741159Y2 publication Critical patent/JPH0741159Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/34—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents for packaging foodstuffs or other articles intended to be cooked or heated within the package
    • B65D81/3446—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents for packaging foodstuffs or other articles intended to be cooked or heated within the package specially adapted to be heated by microwaves
    • B65D81/3453—Rigid containers, e.g. trays, bottles, boxes, cups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/131—Glass, ceramic, or sintered, fused, fired, or calcined metal oxide or metal carbide containing [e.g., porcelain, brick, cement, etc.]
    • Y10T428/1317—Multilayer [continuous layer]

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Food Science & Technology (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)

Description

【図面の簡単な説明】
第１図は実施例に係わるパツケージの接合状態
を示す要部拡大断面図、第２図は実施例において
ベースにキヤツプを接合せんとする状態を示す説
明断面図、第３図は実施例で用いるキヤツプの接
合面側から見た平面図、第４図は実施例で用いる
ベースの接合面から見た平面図である。 １；セラミツクパツケージベース、２；セラミ
ツクキヤツプ、３１，４１；Ｃｕメタライズ層、
３２，４２；下地層、３３，４３；上地層、５；
接合層。

Claims (1)

  1. 【実用新案登録請求の範囲】 セラミツクパツケージベース上に接合層を介し
    てセラミツクキヤツプが気密封止された気密封止
    型セラミツクパツケージにおいて、 上記ベースは低温焼成セラミツクからなり、該
    ベースおよび上記キヤツプの表面上に順次、Ｃｕ
    系金属からなるＣｕメタライズ層、Ｃｕ又はＡｕ
    と合金化しない金属からなる下地層及びＡｕから
    なる上地層を、接合後に気密封止できるように形
    成し、両該上地層表面同志をＡｕＳｎ（金錫合金
    ）からなる接合層を介して接合して気密封止した
    ことを特徴とする気密封止型セラミツクパツケー
    ジ。
JP1988132232U 1988-10-07 1988-10-07 気密封止型セラミックパッケージ Expired - Fee Related JPH0741159Y2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1988132232U JPH0741159Y2 (ja) 1988-10-07 1988-10-07 気密封止型セラミックパッケージ
US07/415,777 US4941582A (en) 1988-10-07 1989-10-02 Hermetically sealed ceramic package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988132232U JPH0741159Y2 (ja) 1988-10-07 1988-10-07 気密封止型セラミックパッケージ

Publications (2)

Publication Number Publication Date
JPH0252444U true JPH0252444U (ja) 1990-04-16
JPH0741159Y2 JPH0741159Y2 (ja) 1995-09-20

Family

ID=15076461

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988132232U Expired - Fee Related JPH0741159Y2 (ja) 1988-10-07 1988-10-07 気密封止型セラミックパッケージ

Country Status (2)

Country Link
US (1) US4941582A (ja)
JP (1) JPH0741159Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013140874A (ja) * 2012-01-05 2013-07-18 Seiko Epson Corp 電子デバイス、セラミック基板、製造方法、及び圧電発振器

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5045639A (en) * 1990-08-21 1991-09-03 Tong Hsing Electronic Industries Ltd. Pin grid array package
US5235139A (en) * 1990-09-12 1993-08-10 Macdermid, Incorprated Method for fabricating printed circuits
JP2002083535A (ja) * 2000-09-06 2002-03-22 Sony Corp 密封容器およびその製造方法ならびに表示装置
GB2372473B (en) * 2001-02-24 2003-04-16 Marconi Caswell Ltd A method of soldering
JP4285753B2 (ja) * 2004-06-21 2009-06-24 田中貴金属工業株式会社 ハーメチックシールカバー及びその製造方法
JP4636849B2 (ja) * 2004-10-22 2011-02-23 株式会社徳力本店 封止材料
JP5329390B2 (ja) * 2007-02-26 2013-10-30 株式会社Ｎｅｏｍａｘマテリアル 気密封止用キャップ、電子部品収納用パッケージおよび電子部品収納用パッケージの製造方法
DE102010042543B4 (de) 2010-06-30 2017-06-29 Vectron International Gmbh Metallisierung für Hohlraumgehäuse und nicht-magnetisches hermetisch dichtes Hohlraumgehäuse
CN115425938A (zh) * 2022-09-28 2022-12-02 天通瑞宏科技有限公司 高可靠性csp封装方法和声表面波滤波器
US20240304539A1 (en) * 2023-03-10 2024-09-12 Advanced Technical Ceramics Company Metal-ceramic mixed package substrate plated with non-magnetic layer stack

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63178548A (ja) * 1987-01-20 1988-07-22 Shinko Electric Ind Co Ltd 電子部品用パツケ−ジとその製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2228703A1 (de) * 1972-06-13 1974-01-10 Licentia Gmbh Verfahren zum herstellen einer vorgegebenen lotschichtstaerke bei der fertigung von halbleiterbauelementen
US4261476A (en) * 1976-12-06 1981-04-14 Mcgraw-Edison Company Joint for envelope of vacuum type electrical device
US4350744A (en) * 1980-12-12 1982-09-21 United Technologies Corporation Metallic solder composite bonding
US4634638A (en) * 1981-12-17 1987-01-06 International Business Machines Corporation High melting point copper-gold-tin brazing alloy for chip carriers
US4587144A (en) * 1982-05-13 1986-05-06 Hillel Kellerman Low loss, compression, hermetic glass-to-metal-seal and method
US4608592A (en) * 1982-07-09 1986-08-26 Nec Corporation Semiconductor device provided with a package for a semiconductor element having a plurality of electrodes to be applied with substantially same voltage
JPS59232693A (ja) * 1983-06-17 1984-12-27 Ngk Spark Plug Co Ltd セラミツクと金属等との接合用クラツドろう材及びこれを用いたセラミツクと金属等との複合体
US4649085A (en) * 1984-08-29 1987-03-10 The United States Of America As Represented By The Secretary Of The Air Force Cryogenic glass-to-metal seal
US4599277A (en) * 1984-10-09 1986-07-08 International Business Machines Corp. Control of the sintering of powdered metals
US4835593A (en) * 1986-05-07 1989-05-30 International Business Machines Corporation Multilayer thin film metallurgy for pin brazing
US4716082A (en) * 1986-10-28 1987-12-29 Isotronics, Inc. Duplex glass preforms for hermetic glass-to-metal sealing

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63178548A (ja) * 1987-01-20 1988-07-22 Shinko Electric Ind Co Ltd 電子部品用パツケ−ジとその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013140874A (ja) * 2012-01-05 2013-07-18 Seiko Epson Corp 電子デバイス、セラミック基板、製造方法、及び圧電発振器

Also Published As

Publication number Publication date
US4941582A (en) 1990-07-17
JPH0741159Y2 (ja) 1995-09-20

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees