JPH0252377U - - Google Patents
Info
- Publication number
- JPH0252377U JPH0252377U JP12864088U JP12864088U JPH0252377U JP H0252377 U JPH0252377 U JP H0252377U JP 12864088 U JP12864088 U JP 12864088U JP 12864088 U JP12864088 U JP 12864088U JP H0252377 U JPH0252377 U JP H0252377U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- electronic component
- hole
- electrically
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 230000002950 deficient Effects 0.000 claims 1
Description
第１図はこの考案の一実施例を示す斜視図、第
２図は第１図のＡ―Ａ′断面図、第３図および第
４図は従来の斜視図である。
２０，２４……第１および第２のプリント基板
、２９Ａ，２９Ｂ，３０Ａ，３０Ｂ……部品取付
部、３２……チツプ部品、３４……半田。
FIG. 1 is a perspective view showing an embodiment of this invention, FIG. 2 is a sectional view taken along the line AA' in FIG. 1, and FIGS. 3 and 4 are perspective views of a conventional device. 20, 24...first and second printed circuit boards, 29A, 29B, 30A, 30B...component mounting portion, 32...chip components, 34...solder.
Claims (1)
両面に固着された回路パターンを電気的に接続し
てなる第１および第２のプリント基板と、この第
１および第２のプリント基板の対向する回路パタ
ーンにそれぞれ形成され、少なくとも一方は前記
スルーホールの近傍に形成してなる第１および第
２の部品取付部と、この第１および第２の部品取
付部間に接続部を挾持してなる電子部品とを備え
、前記スルーホールから半田または導電性接着剤
を流し込んで前記電子部品を前記第１および第２
のプリント基板の部品取付部に電気的に固着して
なる接続手段とからなる多層プリント基板。 (2) スルーホールによりそれぞれの絶縁基板の
両面に固着された回路パターンを電気的に接続し
てなる第１および第２のプリント基板と、この第
１のプリント基板の回路パターンに形成した第１
の部品取付部に予め電気的に取り付けられた電子
部品と、この電子部品上に載置した前記第２のプ
リント基板のスルーホール近傍の回路パターンに
形成し、該電子部品に対向配置してなる第２の不
品取付部とを備え、前記第２のプリント基板のス
ルーホールから半田または導電性接着剤を流し込
んで前記第２のプリント基板および電子部品を電
気的に固着してなる接続手段とからなる多層プリ
ント基板。[Claims for Utility Model Registration] (1) First and second printed circuit boards formed by electrically connecting circuit patterns fixed to both sides of each insulating board through through holes; first and second component mounting portions formed on opposing circuit patterns of a printed circuit board, at least one of which is formed near the through hole, and a connection between the first and second component mounting portions; and an electronic component formed by sandwiching the first and second parts, and solder or conductive adhesive is poured through the through hole to attach the electronic component to the first and second parts.
A multilayer printed circuit board consisting of a connecting means electrically fixed to the component mounting portion of the printed circuit board. (2) first and second printed circuit boards formed by electrically connecting circuit patterns fixed to both surfaces of each insulating board through through holes; and a first printed circuit board formed on the circuit pattern of the first printed circuit board.
An electronic component is electrically attached in advance to the component mounting portion of the electronic component, and a circuit pattern is formed in the vicinity of the through hole of the second printed circuit board placed on the electronic component, and the circuit pattern is arranged opposite to the electronic component. a second defective attachment part, and a connecting means formed by electrically fixing the second printed circuit board and the electronic component by pouring solder or conductive adhesive through a through hole of the second printed circuit board; A multilayer printed circuit board consisting of
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12864088U JPH0252377U (en) | 1988-09-30 | 1988-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12864088U JPH0252377U (en) | 1988-09-30 | 1988-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0252377U true JPH0252377U (en) | 1990-04-16 |
Family
ID=31382171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12864088U Pending JPH0252377U (en) | 1988-09-30 | 1988-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0252377U (en) |
-
1988
- 1988-09-30 JP JP12864088U patent/JPH0252377U/ja active Pending