JPH02501380A - 表面実装電子デバイス用容器 - Google Patents
表面実装電子デバイス用容器Info
- Publication number
- JPH02501380A JPH02501380A JP63508230A JP50823088A JPH02501380A JP H02501380 A JPH02501380 A JP H02501380A JP 63508230 A JP63508230 A JP 63508230A JP 50823088 A JP50823088 A JP 50823088A JP H02501380 A JPH02501380 A JP H02501380A
- Authority
- JP
- Japan
- Prior art keywords
- panel
- layer
- panels
- fold line
- folded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
- B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
- B65D81/107—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using blocks of shock-absorbing material
- B65D81/113—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using blocks of shock-absorbing material of a shape specially adapted to accommodate contents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67396—Closed carriers characterised by the presence of antistatic elements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.第1のパネル(12)と、第1の折線(40)に沿って前記第1のパネル( 12)に接続された第1の接続手段(28)と、前記第1の折線(40)に平行 に第1の折線(38)に沿って前記第1の接続手段(28)に接続された第2の パネル(26)と、前記第1及び第2の折線(40,38)に平行に第3の折線 (70)に沿って前記第1のパネル(12)に接続された第2の接続手段(40 )と、前記第1及び第2のパネル(12,26)に取付けられその間に物品を保 持して保護するよう前記パネル(12,26)が互いにカパーするよう折たたま れたときに互いに共同するクッション手段(14,32)とを含む表面取付電子 装置を包装する折たたみ容器(10)であって、前記クッション手段(14,3 2)は前記パネル(12,26)の一方に取付けられ、前記パネルに取付けられ たホーム状材料の第1層と、同様な複数の電子装置を保持するため複数の個々に 設けられた穴(24)を含み前記第1層(16)に取付けられたホーム状材料の 第2層(18)と、前記第2層(18)に取付けられ穴(22)を有するホーム 状材料の第3層(20)とから成る受手段(14)と、前記パネル(12,26 )が互いに重ね折たたまれたとき前記受手段(14)の前記第3層(20)の前 記穴(22)は前記複数の個々に設けられた穴(24)の各場所に前記電子装置 を収容するためそこに受入れられるように前記パネル(12,26)の他方に取 付けられた前記挿入手段(32)とを含み、前記折たたみ容器は更に前記第3の 折線(70)に平行に第4の折線(68)に沿って前記第2の接続手段(44) に接続され第3のパネル(42)を含み、前記第3のパネル(42)は前記第2 のパネル(26)をカパーするよう回転することができ、前記第3のパネル(4 2)は前記第2のパネル(26)と前記第3のパネル(42)とを接続して固定 した包装を形成するための接続手段(46,48)を有するようにした表面取付 電子装置を包装する折たたみ容器。 2.前記挿入手段(32)は前記複数の前記電子装置を収容するため前記受手段 (14)の前記第3層(20)の穴(22)に嵌込まれる円形状のホーム状部材 てあることを特徴とする請求の範囲1項記載の折たたみ容器。 3.前記接続手段(46,48)は前記第3のパネル(42)に形成された少く とも1つのタプ部(52,60)を含むことを特徴とする請求の範囲1項記載の 折たたみ容器。 4.前記接続手段(28)は前記第1及び第2のパネル(12,26)が互いに 重ね合わされ折たたまれたとき前記受手段(14)が前記挿入手段(32)を嵌 込みうるよう前記受手段(14)のための第1の壁を形成するてとを特徴とする 請求の範囲1項記載の折たたみ容器。 5.前記第2の接続手段(44)は前記第3のパネル(42)が前記第2のパネ ル(26)をカパーするよう折たたまれたとき前記受手段のための第2の壁を形 成するようにしたことを特徴とする請求の範囲1項記載の折たたみ容器。 6.前記第2のパネル(26)は端部(74)を含み、前記第3のパネル(42 )は溝手段(72)を含み、前記第3のパネル(42)が前記第2のパネル(2 6)をカパーするよう折たたまれたとき前記端部(74)を受入れるようにした ことを特徴とする請求の範囲1項記載の折たたみ容器。 7.前記受手段(14)及び前記挿入手段(22)は耐静電気ホーム状材料から 成ることを特徴とする請求の範囲1項記載の折たたみ容器。 8.前記受手段(14)及び前記挿入手段(32)はポリエーテル・ウレタン材 料から成ることを特徴とする請求の範囲1項記載の折たたみ容器。 9.前記第1(12)、第2(26)及び第3のパネル(42)は導電性ファイ バ材料から成るシート状部材てあることを特徴とする請求の範囲1項記載の折た たみ容器。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US103,563 | 1987-10-01 | ||
US07/103,563 US4754880A (en) | 1987-10-01 | 1987-10-01 | Surface mount electronic device package |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02501380A true JPH02501380A (ja) | 1990-05-17 |
JP2906376B2 JP2906376B2 (ja) | 1999-06-21 |
Family
ID=22295850
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63508230A Expired - Fee Related JP2906376B2 (ja) | 1987-10-01 | 1988-09-23 | 表面実装電子デバイス用容器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US4754880A (ja) |
EP (1) | EP0334933B1 (ja) |
JP (1) | JP2906376B2 (ja) |
DE (1) | DE3881509T2 (ja) |
WO (1) | WO1989002860A1 (ja) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2816864B2 (ja) * | 1989-07-07 | 1998-10-27 | 大塚化学株式会社 | 搬送用ウエーハバスケット及び収納ケース |
FR2666312A1 (fr) * | 1990-08-30 | 1992-03-06 | Cit Alcatel | Agencement d'emballage d'objets fragiles tels que des composants electroniques. |
GB2247878B (en) * | 1990-09-15 | 1994-12-14 | Willdaw Foam & Packaging Ltd | Protectors |
FR2672274B1 (fr) * | 1991-02-04 | 1994-11-25 | Wauters Fils Ets Ch | Boite pour le conditionnement d'objets, notamment d'une bouteille. |
US5168996A (en) * | 1991-05-15 | 1992-12-08 | Pathfinder Services, Inc. | Package |
US5163551A (en) * | 1991-06-28 | 1992-11-17 | Digital Equipment Corporation | Integrated circuit device carrier |
US5218510A (en) * | 1991-09-23 | 1993-06-08 | Bradford Company | Suspension packaging for static-sensitive products |
US5271499A (en) * | 1992-09-30 | 1993-12-21 | Horssen Charles A Van | Storage container for model railway cars |
US5295580A (en) * | 1992-10-19 | 1994-03-22 | Hicks Stewart W | Container with overlapping flap closure and nesting spacer |
US5297678A (en) * | 1993-05-28 | 1994-03-29 | Eastman Kodak Company | Film cassette |
US5445251A (en) * | 1993-08-02 | 1995-08-29 | American Trading & Production Corporation | Binder or portfolio |
US5511662A (en) * | 1993-10-25 | 1996-04-30 | Amoroso; Dennis J. | Foam rubber tool retainer |
FR2714893A1 (fr) * | 1994-01-12 | 1995-07-13 | Chapuis Romuald | Carte d'emballage permettant simultanément l'expédition et la promotion ou présentation d'un produit. |
GB9520097D0 (en) * | 1995-10-02 | 1995-12-06 | Kempen Hugo A Van | A presentation box for an article |
EP0811261B1 (en) * | 1995-12-14 | 2002-02-13 | Koninklijke Philips Electronics N.V. | Esd clip for protecting an electronic device against electrostatic discharge |
US6102204A (en) * | 1998-08-11 | 2000-08-15 | Horticultural Technologies, Inc. | Floral transporter |
FR2785257B1 (fr) * | 1998-10-28 | 2001-01-19 | St Microelectronics Sa | Caisse pour plaquettes semiconductrices |
SE513667C2 (sv) * | 1999-01-22 | 2000-10-16 | Ericsson Telefon Ab L M | Ett elektroniskt mönsterkort samt en anordning innefattande ett isolationsmaterial |
GB2348870A (en) * | 1999-04-16 | 2000-10-18 | Brian Michael Sneath | Packaging unit |
KR100765634B1 (ko) * | 2000-05-30 | 2007-10-10 | 닛토덴코 가부시키가이샤 | 판상 물품 수용 케이스 |
TW495480B (en) * | 2000-06-06 | 2002-07-21 | Nitto Denko Corp | Housing case for plate-shaped objects |
US20030230501A1 (en) * | 2002-06-14 | 2003-12-18 | Myra Smolev | Gift and greeting card combination |
EP2144126A1 (fr) * | 2008-07-10 | 2010-01-13 | Breitling AG | Navette pour porte-pièce, système et procédé de transport d'au moins une pièce, notamment d'horlogerie |
US8807338B2 (en) * | 2012-04-24 | 2014-08-19 | Square, Inc. | Mailing package for a light-weight product |
US9533791B2 (en) * | 2013-03-15 | 2017-01-03 | Altria Client Services Llc | Accessory packaging |
US9630566B2 (en) * | 2015-07-27 | 2017-04-25 | Syndicate Sales, Inc. | Seat belt vase carrier |
CN206704735U (zh) * | 2017-04-14 | 2017-12-05 | 苏州伍洲设计包装有限公司 | 一种设置有可更换式凸起的包装盒 |
US20220258947A1 (en) * | 2021-02-14 | 2022-08-18 | Ricardo Ramirez | Protective Packaging for Shipping Items |
SE2230304A1 (en) * | 2022-09-23 | 2024-03-24 | Stora Enso Oyj | A protective packaging insert |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2849111A (en) * | 1955-10-17 | 1958-08-26 | Lengsfield Brothers Inc | Article carrier |
US3016177A (en) * | 1957-11-19 | 1962-01-09 | Diamond National Corp | Molded pulp package |
CH348356A (fr) * | 1959-06-01 | 1960-08-15 | Miremont S A | Emballage pour balancier d'horlogerie |
US3014636A (en) * | 1960-02-29 | 1961-12-26 | Byron H Lengsfield | Carton |
US3303893A (en) * | 1964-03-27 | 1967-02-14 | Justin A Varney | Means for controlling operation of turbodrill |
US3266705A (en) * | 1965-01-11 | 1966-08-16 | Republic Packaging Corp | Cushioned box |
US3273779A (en) * | 1965-02-12 | 1966-09-20 | Republic Packaging Corp | Folded box |
FR1424792A (fr) * | 1965-02-16 | 1966-01-14 | Francispam | Coffret à parois rabattables, notamment pour le transport et la présentation d'objets relativement fragiles tels que pièces d'orfèvrerie, briquets de salon ou bibelots divers |
FR1467166A (fr) * | 1965-12-14 | 1967-01-27 | Emballage pour tube de prélèvements sanguins | |
US4160503A (en) * | 1978-08-07 | 1979-07-10 | Ohlbach Ralph C | Shipping container for printed circuit boards and other items |
US4321901A (en) * | 1979-08-03 | 1982-03-30 | Jidosha Denki Kogyo Kabushiki Kaisha | Automatic speed control device |
US4332322A (en) * | 1980-09-02 | 1982-06-01 | Champion International Corporation | Folder to hold coil of plastic tubing with clamp and fittings |
US4333565A (en) * | 1981-02-27 | 1982-06-08 | Woods Larry N | Anti-static package for electronic chips |
US4528222A (en) * | 1981-04-24 | 1985-07-09 | Pervel Industries, Inc. | Conductively printed flexible sheet material |
GB2173174B (en) * | 1985-04-01 | 1989-06-28 | Eps Group Ltd | Package |
US4671453A (en) * | 1986-09-12 | 1987-06-09 | International Paper Company | Tamper-proof sleeve |
-
1987
- 1987-10-01 US US07/103,563 patent/US4754880A/en not_active Expired - Lifetime
-
1988
- 1988-09-23 EP EP88908881A patent/EP0334933B1/en not_active Expired - Lifetime
- 1988-09-23 WO PCT/US1988/003284 patent/WO1989002860A1/en active IP Right Grant
- 1988-09-23 DE DE88908881T patent/DE3881509T2/de not_active Expired - Fee Related
- 1988-09-23 JP JP63508230A patent/JP2906376B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2906376B2 (ja) | 1999-06-21 |
WO1989002860A1 (en) | 1989-04-06 |
DE3881509T2 (de) | 1994-01-13 |
DE3881509D1 (de) | 1993-07-08 |
EP0334933A1 (en) | 1989-10-04 |
US4754880A (en) | 1988-07-05 |
EP0334933B1 (en) | 1993-06-02 |
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