JPH0247860B2 - - Google Patents

Info

Publication number
JPH0247860B2
JPH0247860B2 JP58135597A JP13559783A JPH0247860B2 JP H0247860 B2 JPH0247860 B2 JP H0247860B2 JP 58135597 A JP58135597 A JP 58135597A JP 13559783 A JP13559783 A JP 13559783A JP H0247860 B2 JPH0247860 B2 JP H0247860B2
Authority
JP
Japan
Prior art keywords
semiconductor device
microscope
deviation
tray
inspected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58135597A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6027138A (ja
Inventor
Naoto Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP13559783A priority Critical patent/JPS6027138A/ja
Publication of JPS6027138A publication Critical patent/JPS6027138A/ja
Publication of JPH0247860B2 publication Critical patent/JPH0247860B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Microscoopes, Condenser (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP13559783A 1983-07-25 1983-07-25 半導体装置用外観検査装置 Granted JPS6027138A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13559783A JPS6027138A (ja) 1983-07-25 1983-07-25 半導体装置用外観検査装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13559783A JPS6027138A (ja) 1983-07-25 1983-07-25 半導体装置用外観検査装置

Publications (2)

Publication Number Publication Date
JPS6027138A JPS6027138A (ja) 1985-02-12
JPH0247860B2 true JPH0247860B2 (en, 2012) 1990-10-23

Family

ID=15155535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13559783A Granted JPS6027138A (ja) 1983-07-25 1983-07-25 半導体装置用外観検査装置

Country Status (1)

Country Link
JP (1) JPS6027138A (en, 2012)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6250719A (ja) * 1985-08-29 1987-03-05 Nireko:Kk 顕微鏡等による画像測定における走査位置の割り出し方法
KR102576071B1 (ko) * 2021-07-16 2023-09-08 주식회사 센서뷰 소형 커넥터 테스트용 연결지그

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5628244B2 (en, 2012) * 1973-09-10 1981-06-30

Also Published As

Publication number Publication date
JPS6027138A (ja) 1985-02-12

Similar Documents

Publication Publication Date Title
DE69125986T2 (de) Verfahren und gerät zur messung des winkels eines werkstücks
DE102018124712A1 (de) Arbeitssystem, Verfahren zum Durchführen von Arbeit an einem Objekt und Roboter
DE69318252T2 (de) Verfahren zur Befestigung von Bauelementen auf einem Substrat und Bestückungsmaschine hierfür
DE102004043282B4 (de) Verfahren für die Justierung des Bondkopfs eines Die-Bonders
JP6012742B2 (ja) 作業装置
DE102017222478A1 (de) Laserbearbeitungsvorrichtung
EP3639689A1 (en) Processing method using depth image detection
DE102020208553A1 (de) Laserbearbeitungsvorrichtung
DE60031865T2 (de) Verfahren und vorrichtung zur erkennung eines werkstückes sowie verfahren und vorrichtung zur bestückung
CN110433989B (zh) 一种工件表面喷涂的方法
JP4132085B2 (ja) 高速位置決め機構を有するウェブまたはシート供給装置
DE112015006798B4 (de) Bauteilmontagevorrichtung
EP3710198B1 (de) Bearbeitungsvorrichtung
DE102017222477A1 (de) Laserbearbeitungsvorrichtung
DE102020207130A1 (de) SiC-WAFERHERSTELLUNGSVERFAHREN UND SiC-WAFERHERSTELLUNGSVORRICHTUNG
DE102020215212B4 (de) Verfahren zum Anpassen einer Laserbearbeitungsvorrichtung
EP0082442B1 (de) Messmaschine in Portalbauweise
JPH0247860B2 (en, 2012)
JP3744179B2 (ja) 電子部品実装方法
WO2001078111A1 (de) Vorrichtung zum handling von bauelementen
DE3711646C2 (de) Vorrichtung zum Ermitteln der Lage einer Kerblinie auf der Oberfläche eines Werkstückes und zum Einstellen des Werkstückes in eine Biegeposition
DE112016006383T5 (de) Oberflächenmontagegerät und Verfahren zum Korrigieren von Erkennungsfehlern
CN216064800U (zh) 一种高精度传感器自动化封装流水线
DE2534224C2 (de) Verfahren zum Identifizieren eines Werkstückes und Vorrichtung zum Durchführen des Verfahrens
DE112016006191B4 (de) System aus einer Bewegungsfehlerdetektionseinrichtung eines Montagekopfs und einer Bauteilmontageeinrichtung