JPH0247860B2 - - Google Patents
Info
- Publication number
- JPH0247860B2 JPH0247860B2 JP58135597A JP13559783A JPH0247860B2 JP H0247860 B2 JPH0247860 B2 JP H0247860B2 JP 58135597 A JP58135597 A JP 58135597A JP 13559783 A JP13559783 A JP 13559783A JP H0247860 B2 JPH0247860 B2 JP H0247860B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- microscope
- deviation
- tray
- inspected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 37
- 238000007689 inspection Methods 0.000 claims description 9
- 238000003909 pattern recognition Methods 0.000 claims description 8
- 238000011179 visual inspection Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Description
【発明の詳細な説明】
本発明は、半導体装置用外観検査装置に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an external appearance inspection apparatus for semiconductor devices.
従来、一般的なセラミツク封止型の半導体装置
の外観検査作業は、生産量が少ないために作業者
が一個ずつ取出して、手作業で行なわれていた
が、高品質が要求されつつある近年では、セラミ
ツク封止型半導体装置の生産が増大しており、検
査作業を手作業で行なつていては処理数が小さい
という欠点があつた。 In the past, the appearance inspection of general ceramic-sealed semiconductor devices was carried out manually, with workers picking them out one by one due to the low production volume.However, in recent years, as high quality is required, As the production of ceramic-sealed semiconductor devices is increasing, manual inspection work has the disadvantage that the number of tests is small.
本発明は前記問題点を解消する半自動の装置を
提供することを目的としている。 The object of the present invention is to provide a semi-automatic device which solves the above-mentioned problems.
本発明の特徴は、リードフレーム枠体を有する
組立中のデユアルインライン型のセラミツク封止
半導体装置の上方に、固定された顕微鏡を設け該
顕微鏡により前記半導体装置の外観を検査する半
導体装置用外観検査装置において、前記半導体装
置の上方で前記顕微鏡から水平面内の一方向に所
定距離だけ離れた位置に固定され、前記半導体装
置が所定位置からずれたズレ量を電気的に把握す
るパターン認識装置と、平面板の所定領域に前記
半導体装置が搭載される上面と、該半導体装置の
リードフレーム枠体を案内する側面を有し、前記
一方向に直線状にのびた凸形状が複数本平行に設
けられているトレーと、前記トレーを水平面内で
移動させる２次元移動機構とを設け、前記トレー
の各凸形状の上面に前記半導体装置を搭載し、該
半導体装置を前記顕微鏡で検査する以前に、あら
かじめ前記パターン認識装置を用いて該半導体装
置が前記一方向に沿つた所定のピツチ移動により
ずれたズレ量を把握し、ずれがない時は、前記ト
レーを前記一方向に所定のピツチで移動して該半
導体装置を外観検査し、ずれがある時は、前記ズ
レ量を補正して該半導体装置が前記顕微鏡視野の
ほぼ中央点にくるように前記トレーを前記一方向
に移動せしめて外観検査する半導体装置用外観検
査装置にある。 A feature of the present invention is that a fixed microscope is provided above a dual-in-line type ceramic-sealed semiconductor device that is being assembled and has a lead frame frame body, and the external appearance of the semiconductor device is inspected using the microscope. In the apparatus, a pattern recognition device is fixed at a position above the semiconductor device at a predetermined distance apart from the microscope in one direction in a horizontal plane, and electrically detects the amount of deviation of the semiconductor device from a predetermined position; The flat plate has an upper surface on which the semiconductor device is mounted in a predetermined area, and a side surface that guides a lead frame frame of the semiconductor device, and a plurality of convex shapes extending linearly in the one direction are provided in parallel. the semiconductor device is mounted on the upper surface of each convex shape of the tray, and the semiconductor device is inspected with the microscope beforehand. A pattern recognition device is used to ascertain the amount of deviation of the semiconductor device by moving the semiconductor device at a predetermined pitch along the one direction, and when there is no deviation, the tray is moved in the one direction at a predetermined pitch to correct the deviation. A semiconductor device in which a semiconductor device is visually inspected, and if there is a deviation, the tray is moved in the one direction so that the amount of deviation is corrected and the semiconductor device is located at approximately the center of the field of view of the microscope, and the semiconductor device is visually inspected. Appearance inspection equipment for use.
次に本発明の一実施例を図面を用いて説明す
る。 Next, one embodiment of the present invention will be described using the drawings.
第１図に示す様に、半導体素子１を搭載したセ
ラミツク封止型の半導体装置２は、某手段によつ
てトレー３に搭載されているが、半導体装置２は
Ｘ方向にはトレー３の凸形状によつてある程度の
範囲に規制されるため、外観検査には支障がな
い。しかしながら、パターン認識装置４のない場
合はＹ方向の規制はなく、検査点からΔlの量が
ズレて、顕微鏡５の視野から外れることがあつ
た。 As shown in FIG. 1, a ceramic-sealed semiconductor device 2 on which a semiconductor element 1 is mounted is mounted on a tray 3 by a certain means. Since it is regulated within a certain range depending on the shape, there is no problem in visual inspection. However, without the pattern recognition device 4, there is no regulation in the Y direction, and the amount of Δl may deviate from the inspection point, causing the inspection point to fall out of the field of view of the microscope 5.
つまり、第２図で示す様に、第２図ｂはパター
ン認識装置における半導体装置２の画像を示す
が、この場合Ｙ方向に中心からΔlズレている。
Δlのズレがなければ第２図ａの実線で示す様に、
固定ピツチの移動により顕微鏡の視野の中央に移
動するが、Δlのズレがあるために一定鎖線で示
す様に視野から外れ外観検査が困難になる。 That is, as shown in FIG. 2, FIG. 2b shows an image of the semiconductor device 2 in the pattern recognition apparatus, but in this case, it is shifted by Δl from the center in the Y direction.
If there is no deviation of Δl, as shown by the solid line in Figure 2 a,
By moving the fixed pitch, it moves to the center of the field of view of the microscope, but due to the deviation of Δl, it falls out of the field of view as shown by the constant chain line, making visual inspection difficult.
本発明による装置では、顕微鏡５で検査する以
前の個所において、ズレ量Δlをパターン認識装
置４にて電気的に処理判断する。これを任意の手
段で記憶しておき、顕微鏡５の検査点へ半導体装
置２をトレー３と共に固定された設定ピツチ移動
する際、Ｙ方向を（−Δl）補正して視野のほぼ
中央へ移動する。 In the apparatus according to the present invention, the amount of deviation Δl is electrically processed and judged by the pattern recognition device 4 at a location before being inspected by the microscope 5. This is memorized by any means, and when moving the semiconductor device 2 along with the tray 3 by the fixed pitch to the inspection point of the microscope 5, the Y direction is corrected by (-Δl) and the device is moved to the approximate center of the field of view. .
さらに本装置では、半導体装置・２およびトレ
ー３と共に移動するＸ・Ｙ方向の移動機構を設け
てあり、これはサーボモータ等で高速駆動され
る。 Furthermore, this apparatus is provided with a moving mechanism in the X and Y directions that moves together with the semiconductor device 2 and the tray 3, which is driven at high speed by a servo motor or the like.
本発明の効果は、検査する半導体装置・２の位
置がズレていても常に補正しながら顕微鏡５の視
野中央へ高速で移動供給してくるために、外観検
査作業の処理数が増大し、コストの低減が可能と
なる。 The effect of the present invention is that even if the position of the semiconductor device 2 to be inspected is shifted, it is constantly corrected and supplied by moving to the center of the field of view of the microscope 5 at high speed, thereby increasing the number of visual inspection operations and reducing costs. It is possible to reduce the
第１図は本発明の実施例を示す概略図であり、
第２図は視野図である。
尚、図において、１……半導体素子、２……半
導体装置、３……トレー、４……パターン認識装
置、５……顕微鏡である。
FIG. 1 is a schematic diagram showing an embodiment of the present invention,
Figure 2 is a visual field diagram. In the figure, 1...semiconductor element, 2... semiconductor device, 3... tray, 4... pattern recognition device, 5... microscope.
Claims (1)
ルインライン型のセラミツク封止半導体装置の上
方に、固定された顕微鏡を設け該顕微鏡により前
記半導体装置の外観を検査する半導体装置用外観
検査装置において、前記半導体装置の上方で前記
顕微鏡から水平面内の一方向に所定距離だけ離れ
た位置に固定され、前記半導体装置が所定位置か
らずれたズレ量を電気的に把握するパターン認識
装置と、平面板の所定領域に前記半導体装置が搭
載される上面と、該半導体装置のリードフレーム
枠体を案内する側面を有し、前記一方向に直線状
にのびた凸形状が複数本平行に設けられているト
レーと、前記トレーを水平面内で移動させる２次
元移動機構とを設け、前記トレーの各凸形状の上
面に前記半導体装置を搭載し、該半導体装置を前
記顕微鏡で検査する以前に、あらかじめ前記パタ
ーン認識装置を用いて該半導体装置が前記一方向
に沿つた所定のピツチ移動によりずれたズレ量を
把握し、ずれがない時は、前記トレーを前記一方
向に所定のピツチで移動して該半導体装置を外観
検査し、ずれがある時は、前記ズレ量を補正して
該半導体装置が前記顕微鏡視野のほぼ中央点にく
るように前記トレーを前記一方向に移動せしめて
外観検査することを特徴とする半導体装置用外観
検査装置。1. In an external appearance inspection apparatus for a semiconductor device, a fixed microscope is provided above a dual-in-line ceramic-sealed semiconductor device having a lead frame and being assembled, and the external appearance of the semiconductor device is inspected using the microscope. a pattern recognition device fixed above the device at a predetermined distance apart from the microscope in one direction in a horizontal plane, and electrically detecting the amount of deviation of the semiconductor device from a predetermined position; and a predetermined area of a flat plate. a tray having an upper surface on which the semiconductor device is mounted, and a side surface for guiding a lead frame frame of the semiconductor device, and a plurality of convex shapes extending linearly in one direction are provided in parallel; a two-dimensional movement mechanism for moving the tray in a horizontal plane, the semiconductor device is mounted on the upper surface of each convex shape of the tray, and before the semiconductor device is inspected with the microscope, the pattern recognition device is used in advance. to ascertain the amount of deviation of the semiconductor device by moving it at a predetermined pitch along the one direction, and if there is no deviation, move the tray in the one direction at a predetermined pitch and inspect the appearance of the semiconductor device. However, when there is a deviation, the tray is moved in the one direction so that the amount of deviation is corrected and the semiconductor device is located approximately at the center of the field of view of the microscope, and the appearance of the semiconductor device is inspected. Appearance inspection equipment for use.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13559783A JPS6027138A (en) | 1983-07-25 | 1983-07-25 | Appearance inspecting apparatus for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13559783A JPS6027138A (en) | 1983-07-25 | 1983-07-25 | Appearance inspecting apparatus for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6027138A JPS6027138A (en) | 1985-02-12 |
| JPH0247860B2 true JPH0247860B2 (en) | 1990-10-23 |
Family
ID=15155535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13559783A Granted JPS6027138A (en) | 1983-07-25 | 1983-07-25 | Appearance inspecting apparatus for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6027138A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6250719A (en) * | 1985-08-29 | 1987-03-05 | Nireko:Kk | Indexing method for scanning position in image measurement by microscope or the like |
| KR102576071B1 (en) * | 2021-07-16 | 2023-09-08 | 주식회사 센서뷰 | Connecting Zig for testing small connector |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5054344A (en) * | 1973-09-10 | 1975-05-14 |
-
1983
- 1983-07-25 JP JP13559783A patent/JPS6027138A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5054344A (en) * | 1973-09-10 | 1975-05-14 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6027138A (en) | 1985-02-12 |
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