JPH0247029U - - Google Patents

Info

Publication number
JPH0247029U
JPH0247029U JP12564588U JP12564588U JPH0247029U JP H0247029 U JPH0247029 U JP H0247029U JP 12564588 U JP12564588 U JP 12564588U JP 12564588 U JP12564588 U JP 12564588U JP H0247029 U JPH0247029 U JP H0247029U
Authority
JP
Japan
Prior art keywords
substrate
opening
support plate
size
cvd apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12564588U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0622980Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988125645U priority Critical patent/JPH0622980Y2/ja
Publication of JPH0247029U publication Critical patent/JPH0247029U/ja
Application granted granted Critical
Publication of JPH0622980Y2 publication Critical patent/JPH0622980Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP1988125645U 1988-09-28 1988-09-28 Ｃｖｄ装置における基板支持装置 Expired - Fee Related JPH0622980Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988125645U JPH0622980Y2 (ja) 1988-09-28 1988-09-28 Ｃｖｄ装置における基板支持装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988125645U JPH0622980Y2 (ja) 1988-09-28 1988-09-28 Ｃｖｄ装置における基板支持装置

Publications (2)

Publication Number Publication Date
JPH0247029U true JPH0247029U (ko) 1990-03-30
JPH0622980Y2 JPH0622980Y2 (ja) 1994-06-15

Family

ID=31376432

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988125645U Expired - Fee Related JPH0622980Y2 (ja) 1988-09-28 1988-09-28 Ｃｖｄ装置における基板支持装置

Country Status (1)

Country Link
JP (1) JPH0622980Y2 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006118215A1 (ja) * 2005-04-28 2006-11-09 Hitachi Kokusai Electric Inc. 基板処理装置および半導体デバイスの製造方法
WO2022137301A1 (ja) * 2020-12-21 2022-06-30 株式会社Kokusai Electric 基板処理装置、基板保持具、半導体装置の製造方法及びプログラム

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52139766U (ko) * 1976-04-16 1977-10-22
JPS5376396A (en) * 1976-12-18 1978-07-06 Agency Of Ind Science & Technol Base plate securing jig for liquid phase epitaxial growth
JPS57164524A (en) * 1981-04-02 1982-10-09 Toshiba Corp Vapor reaction for semiconductor wafer
JPS58108735A (ja) * 1981-12-23 1983-06-28 Fujitsu Ltd 縦型反応管用バスケツト
JPS59117138U (ja) * 1983-01-27 1984-08-07 日本電気ホームエレクトロニクス株式会社 半導体製造装置
JPS611017A (ja) * 1984-06-13 1986-01-07 Kokusai Electric Co Ltd 半導体基板の熱処理装置
JPS6252929U (ko) * 1985-09-21 1987-04-02
JPS62142839U (ko) * 1986-03-04 1987-09-09
JPS62147332U (ko) * 1987-03-12 1987-09-17
JPH01168030A (ja) * 1987-12-24 1989-07-03 Touyoko Kagaku Kk 減圧気相成長方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52139766U (ko) * 1976-04-16 1977-10-22
JPS5376396A (en) * 1976-12-18 1978-07-06 Agency Of Ind Science & Technol Base plate securing jig for liquid phase epitaxial growth
JPS57164524A (en) * 1981-04-02 1982-10-09 Toshiba Corp Vapor reaction for semiconductor wafer
JPS58108735A (ja) * 1981-12-23 1983-06-28 Fujitsu Ltd 縦型反応管用バスケツト
JPS59117138U (ja) * 1983-01-27 1984-08-07 日本電気ホームエレクトロニクス株式会社 半導体製造装置
JPS611017A (ja) * 1984-06-13 1986-01-07 Kokusai Electric Co Ltd 半導体基板の熱処理装置
JPS6252929U (ko) * 1985-09-21 1987-04-02
JPS62142839U (ko) * 1986-03-04 1987-09-09
JPS62147332U (ko) * 1987-03-12 1987-09-17
JPH01168030A (ja) * 1987-12-24 1989-07-03 Touyoko Kagaku Kk 減圧気相成長方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006118215A1 (ja) * 2005-04-28 2006-11-09 Hitachi Kokusai Electric Inc. 基板処理装置および半導体デバイスの製造方法
JPWO2006118215A1 (ja) * 2005-04-28 2008-12-18 株式会社日立国際電気 基板処理装置および半導体デバイスの製造方法
WO2022137301A1 (ja) * 2020-12-21 2022-06-30 株式会社Kokusai Electric 基板処理装置、基板保持具、半導体装置の製造方法及びプログラム

Also Published As

Publication number Publication date
JPH0622980Y2 (ja) 1994-06-15

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees