JPH024674B2 - - Google Patents
Info
- Publication number
- JPH024674B2 JPH024674B2 JP10341385A JP10341385A JPH024674B2 JP H024674 B2 JPH024674 B2 JP H024674B2 JP 10341385 A JP10341385 A JP 10341385A JP 10341385 A JP10341385 A JP 10341385A JP H024674 B2 JPH024674 B2 JP H024674B2
- Authority
- JP
- Japan
- Prior art keywords
- sputtering
- target
- gas
- cathode
- anode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000007789 gas Substances 0.000 claims description 25
- 238000004544 sputter deposition Methods 0.000 claims description 25
- 239000011261 inert gas Substances 0.000 claims description 2
- 239000010408 film Substances 0.000 description 14
- 239000000758 substrate Substances 0.000 description 13
- 239000002184 metal Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000005684 electric field Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000035485 pulse pressure Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10341385A JPS61261473A (ja) | 1985-05-15 | 1985-05-15 | スパツタリング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10341385A JPS61261473A (ja) | 1985-05-15 | 1985-05-15 | スパツタリング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61261473A JPS61261473A (ja) | 1986-11-19 |
| JPH024674B2 true JPH024674B2 (enrdf_load_stackoverflow) | 1990-01-30 |
Family
ID=14353359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10341385A Granted JPS61261473A (ja) | 1985-05-15 | 1985-05-15 | スパツタリング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61261473A (enrdf_load_stackoverflow) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3700633C2 (de) * | 1987-01-12 | 1997-02-20 | Reinar Dr Gruen | Verfahren und Vorrichtung zum schonenden Beschichten elektrisch leitender Gegenstände mittels Plasma |
| JP2578815B2 (ja) * | 1987-07-08 | 1997-02-05 | 松下電器産業株式会社 | 直流スパッタリング法 |
| DE19703791C2 (de) * | 1997-02-01 | 2001-10-11 | Fraunhofer Ges Forschung | Verfahren zur Regelung von Glimmentladungen mit pulsförmiger Energieversorgung |
| KR101593544B1 (ko) * | 2008-12-15 | 2016-02-15 | 가부시키가이샤 알박 | 스퍼터링 장치 및 스퍼터링 방법 |
| JP5495083B1 (ja) * | 2013-02-28 | 2014-05-21 | 株式会社アヤボ | パルススパッタ装置 |
| JP6239346B2 (ja) * | 2013-02-28 | 2017-11-29 | 株式会社アヤボ | パルススパッタ装置 |
| JP5493139B1 (ja) | 2013-05-29 | 2014-05-14 | 独立行政法人科学技術振興機構 | ナノクラスター生成装置 |
-
1985
- 1985-05-15 JP JP10341385A patent/JPS61261473A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61261473A (ja) | 1986-11-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |