JPH024389B2 - - Google Patents
Info
- Publication number
- JPH024389B2 JPH024389B2 JP19602284A JP19602284A JPH024389B2 JP H024389 B2 JPH024389 B2 JP H024389B2 JP 19602284 A JP19602284 A JP 19602284A JP 19602284 A JP19602284 A JP 19602284A JP H024389 B2 JPH024389 B2 JP H024389B2
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- solder
- iron
- cleaning
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 claims description 58
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 56
- 229910000679 solder Inorganic materials 0.000 claims description 29
- 229910052742 iron Inorganic materials 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 21
- 238000004140 cleaning Methods 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009736 wetting Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19602284A JPS6174768A (ja) | 1984-09-19 | 1984-09-19 | 半田付方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19602284A JPS6174768A (ja) | 1984-09-19 | 1984-09-19 | 半田付方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6174768A JPS6174768A (ja) | 1986-04-17 |
| JPH024389B2 true JPH024389B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-01-29 |
Family
ID=16350916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19602284A Granted JPS6174768A (ja) | 1984-09-19 | 1984-09-19 | 半田付方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6174768A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1984
- 1984-09-19 JP JP19602284A patent/JPS6174768A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6174768A (ja) | 1986-04-17 |