JPH0242786B2 - - Google Patents
Info
- Publication number
- JPH0242786B2 JPH0242786B2 JP11540485A JP11540485A JPH0242786B2 JP H0242786 B2 JPH0242786 B2 JP H0242786B2 JP 11540485 A JP11540485 A JP 11540485A JP 11540485 A JP11540485 A JP 11540485A JP H0242786 B2 JPH0242786 B2 JP H0242786B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- less
- tends
- porcelain
- sintering temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052573 porcelain Inorganic materials 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 8
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims description 7
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 6
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 6
- 229910016569 AlF 3 Inorganic materials 0.000 claims description 4
- 229910004261 CaF 2 Inorganic materials 0.000 claims description 4
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 4
- 229910016036 BaF 2 Inorganic materials 0.000 claims description 3
- 229910018068 Li 2 O Inorganic materials 0.000 claims description 3
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 3
- FVRNDBHWWSPNOM-UHFFFAOYSA-L strontium fluoride Chemical compound [F-].[F-].[Sr+2] FVRNDBHWWSPNOM-UHFFFAOYSA-L 0.000 claims description 2
- 229910001637 strontium fluoride Inorganic materials 0.000 claims description 2
- 238000005245 sintering Methods 0.000 description 10
- 239000003153 chemical reaction reagent Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000395 magnesium oxide Substances 0.000 description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 description 1
- 229910017309 Mo—Mn Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- PNEFIWYZWIQKEK-UHFFFAOYSA-N carbonic acid;lithium Chemical compound [Li].OC(O)=O PNEFIWYZWIQKEK-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 238000004108 freeze drying Methods 0.000 description 1
- 239000001863 hydroxypropyl cellulose Substances 0.000 description 1
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- DVQHRBFGRZHMSR-UHFFFAOYSA-N sodium methyl 2,2-dimethyl-4,6-dioxo-5-(N-prop-2-enoxy-C-propylcarbonimidoyl)cyclohexane-1-carboxylate Chemical compound [Na+].C=CCON=C(CCC)[C-]1C(=O)CC(C)(C)C(C(=O)OC)C1=O DVQHRBFGRZHMSR-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
Landscapes
- Compositions Of Oxide Ceramics (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11540485A JPS61275162A (ja) | 1985-05-30 | 1985-05-30 | 低温焼結磁器組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11540485A JPS61275162A (ja) | 1985-05-30 | 1985-05-30 | 低温焼結磁器組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61275162A JPS61275162A (ja) | 1986-12-05 |
| JPH0242786B2 true JPH0242786B2 (enrdf_load_stackoverflow) | 1990-09-26 |
Family
ID=14661729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11540485A Granted JPS61275162A (ja) | 1985-05-30 | 1985-05-30 | 低温焼結磁器組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61275162A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101215157B (zh) * | 2008-01-11 | 2011-08-17 | 清华大学 | 掺氟硅铝玻璃基低温共烧陶瓷材料及其制备方法 |
| JP5133207B2 (ja) * | 2008-11-08 | 2013-01-30 | 住友化学株式会社 | チタン酸アルミニウム系セラミックスの製造方法 |
-
1985
- 1985-05-30 JP JP11540485A patent/JPS61275162A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61275162A (ja) | 1986-12-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0256304B2 (enrdf_load_stackoverflow) | ||
| US4540671A (en) | Glass-ceramic product | |
| JPH0442349B2 (enrdf_load_stackoverflow) | ||
| JPH04275975A (ja) | ガラス−セラミックス複合体 | |
| JP3096136B2 (ja) | 低温焼成基板用ガラス組成物およびそれから得られる基板 | |
| JPH0242786B2 (enrdf_load_stackoverflow) | ||
| JPH01141837A (ja) | 回路基板用誘電体材料 | |
| JPS636499B2 (enrdf_load_stackoverflow) | ||
| JPS62278145A (ja) | ガラスセラミツク焼結体 | |
| JPH10194828A (ja) | 低温焼成セラミックス多層基板とその製造方法 | |
| JPH01132194A (ja) | 配線基板 | |
| JPS6331420B2 (enrdf_load_stackoverflow) | ||
| JPS6210940B2 (enrdf_load_stackoverflow) | ||
| JPH09241068A (ja) | 低温焼成セラミックス基板 | |
| JPS6379739A (ja) | ガラスセラミツク焼結体 | |
| JPH0457627B2 (enrdf_load_stackoverflow) | ||
| JPH0421630B2 (enrdf_load_stackoverflow) | ||
| JP2824292B2 (ja) | 封着材料 | |
| JPH0232587A (ja) | 回路基板用組成物及びそれを使用した電子部品 | |
| JPH06199541A (ja) | ガラスセラミックス組成物 | |
| KR930008458B1 (ko) | 착색 알루미나 세라믹 조성물 | |
| JPH0419176B2 (enrdf_load_stackoverflow) | ||
| JPS6227353A (ja) | ガラスセラミツク複合材 | |
| JPH04130052A (ja) | セラミック基板用原料組成物およびそれを用いた基板の製造方法 | |
| JPS61186261A (ja) | セラミツクス焼結体 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |