JPH0241873Y2 - - Google Patents
Info
- Publication number
- JPH0241873Y2 JPH0241873Y2 JP1985142941U JP14294185U JPH0241873Y2 JP H0241873 Y2 JPH0241873 Y2 JP H0241873Y2 JP 1985142941 U JP1985142941 U JP 1985142941U JP 14294185 U JP14294185 U JP 14294185U JP H0241873 Y2 JPH0241873 Y2 JP H0241873Y2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- printed circuit
- circuit board
- flow
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 86
- 238000009713 electroplating Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229910021645 metal ion Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 230000005587 bubbling Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003411 electrode reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985142941U JPH0241873Y2 (pt) | 1985-09-19 | 1985-09-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985142941U JPH0241873Y2 (pt) | 1985-09-19 | 1985-09-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62118479U JPS62118479U (pt) | 1987-07-28 |
| JPH0241873Y2 true JPH0241873Y2 (pt) | 1990-11-08 |
Family
ID=31052153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985142941U Expired JPH0241873Y2 (pt) | 1985-09-19 | 1985-09-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0241873Y2 (pt) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102007026635B4 (de) * | 2007-06-06 | 2010-07-29 | Atotech Deutschland Gmbh | Vorrichtung zum nasschemischen Behandeln von Ware, Verwendung eines Strömungsorgans, Verfahren zum Einbauen eines Strömungsorgans in die Vorrichtung sowie Verfahren zur Herstellung einer nasschemisch behandelten Ware |
| WO2021210150A1 (ja) * | 2020-04-17 | 2021-10-21 | 株式会社メイコー | 回路基板の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5079439A (pt) * | 1973-11-16 | 1975-06-27 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59117678U (ja) * | 1983-01-31 | 1984-08-08 | 松下電工株式会社 | 複合メツキ装置 |
-
1985
- 1985-09-19 JP JP1985142941U patent/JPH0241873Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5079439A (pt) * | 1973-11-16 | 1975-06-27 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62118479U (pt) | 1987-07-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE69033245T2 (de) | Verfahren und vorrichtung zur herstellung von feinen leiterbahnen mit kleinen abständen | |
| JPH04503532A (ja) | 基板上に微細な回路パターンを形成する装置 | |
| US4043891A (en) | Electrolytic cell with bipolar electrodes | |
| KR20010033089A (ko) | 피변조 전계를 이용한 작은 홈 내의 금속 전착 | |
| US5167779A (en) | Process and apparatus for electrolyte exchange | |
| JP2009299128A (ja) | 電気めっき装置 | |
| JPH0241873Y2 (pt) | ||
| JP4579306B2 (ja) | 円形めっき槽 | |
| US3878062A (en) | Electroplating apparatus and method | |
| KR100956685B1 (ko) | 도금장치 | |
| JPS6234837B2 (pt) | ||
| US20070144896A1 (en) | Plating process enhanced by squeegee roller apparatus | |
| US4692222A (en) | Electroplating method and apparatus for electroplating high aspect ratio thru-holes | |
| KR102438116B1 (ko) | 인쇄회로기판 도금장치 | |
| US3645855A (en) | Ultrasonic repair plating of microscopic interconnections | |
| US4587000A (en) | Electroplating method and apparatus for electroplating high aspect ratio thru-holes | |
| KR900005846B1 (ko) | 고속도금방법 | |
| JPS6277494A (ja) | プリント基板のメツキ装置 | |
| JPS6277495A (ja) | プリント基板のメツキ装置 | |
| JP2000256891A (ja) | 電解めっき方法および陽極構造体 | |
| JP2006041172A (ja) | スルーホールを有するプリント配線板のメッキ方法およびメッキ装置 | |
| JP4410387B2 (ja) | ビアホール充填装置 | |
| KR200358909Y1 (ko) | 양면 균일 도금층을 갖게 하는 전기도금장치 | |
| JPS62202099A (ja) | プリント基板のメツキ装置 | |
| JP3037179B2 (ja) | 自動メッキ装置 |