JPH0241864Y2 - - Google Patents

Info

Publication number
JPH0241864Y2
JPH0241864Y2 JP1983165393U JP16539383U JPH0241864Y2 JP H0241864 Y2 JPH0241864 Y2 JP H0241864Y2 JP 1983165393 U JP1983165393 U JP 1983165393U JP 16539383 U JP16539383 U JP 16539383U JP H0241864 Y2 JPH0241864 Y2 JP H0241864Y2
Authority
JP
Japan
Prior art keywords
bonding
capillary
gold
tip
ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983165393U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6073238U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983165393U priority Critical patent/JPS6073238U/ja
Publication of JPS6073238U publication Critical patent/JPS6073238U/ja
Application granted granted Critical
Publication of JPH0241864Y2 publication Critical patent/JPH0241864Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/536—

Landscapes

  • Wire Bonding (AREA)
JP1983165393U 1983-10-27 1983-10-27 ワイヤボンデイング用キヤピラリ Granted JPS6073238U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983165393U JPS6073238U (ja) 1983-10-27 1983-10-27 ワイヤボンデイング用キヤピラリ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983165393U JPS6073238U (ja) 1983-10-27 1983-10-27 ワイヤボンデイング用キヤピラリ

Publications (2)

Publication Number Publication Date
JPS6073238U JPS6073238U (ja) 1985-05-23
JPH0241864Y2 true JPH0241864Y2 (enExample) 1990-11-08

Family

ID=30362367

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983165393U Granted JPS6073238U (ja) 1983-10-27 1983-10-27 ワイヤボンデイング用キヤピラリ

Country Status (1)

Country Link
JP (1) JPS6073238U (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7261230B2 (en) * 2003-08-29 2007-08-28 Freescale Semiconductor, Inc. Wirebonding insulated wire and capillary therefor

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
BONDING HANDBOOK=1979 *
MICRO-SWISSubh|-þbþ *

Also Published As

Publication number Publication date
JPS6073238U (ja) 1985-05-23

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