JPH0239969Y2 - - Google Patents
Info
- Publication number
- JPH0239969Y2 JPH0239969Y2 JP13090184U JP13090184U JPH0239969Y2 JP H0239969 Y2 JPH0239969 Y2 JP H0239969Y2 JP 13090184 U JP13090184 U JP 13090184U JP 13090184 U JP13090184 U JP 13090184U JP H0239969 Y2 JPH0239969 Y2 JP H0239969Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- taping packaging
- electronic components
- taping
- packaging material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 29
- 239000005022 packaging material Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- -1 polypropylene Polymers 0.000 claims description 5
- 239000004743 Polypropylene Substances 0.000 claims description 4
- 229920001155 polypropylene Polymers 0.000 claims description 4
- 229920005992 thermoplastic resin Polymers 0.000 claims description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 3
- 239000005977 Ethylene Substances 0.000 claims description 3
- 229920001577 copolymer Polymers 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 229920006267 polyester film Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 11
- 238000004806 packaging method and process Methods 0.000 description 9
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 6
- 239000000126 substance Substances 0.000 description 4
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 2
- 238000007666 vacuum forming Methods 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229920006378 biaxially oriented polypropylene Polymers 0.000 description 1
- 239000011127 biaxially oriented polypropylene Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 1
- 239000005043 ethylene-methyl acrylate Substances 0.000 description 1
- 229920005680 ethylene-methyl methacrylate copolymer Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13090184U JPS6145380U (ja) | 1984-08-29 | 1984-08-29 | 電子部品用のテ−ピング包装材料 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13090184U JPS6145380U (ja) | 1984-08-29 | 1984-08-29 | 電子部品用のテ−ピング包装材料 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6145380U JPS6145380U (ja) | 1986-03-26 |
| JPH0239969Y2 true JPH0239969Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-10-25 |
Family
ID=30689493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13090184U Granted JPS6145380U (ja) | 1984-08-29 | 1984-08-29 | 電子部品用のテ−ピング包装材料 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6145380U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH083036Y2 (ja) * | 1990-02-26 | 1996-01-29 | 住友ベークライト株式会社 | チップ型電子部品包装用カバーテープ |
-
1984
- 1984-08-29 JP JP13090184U patent/JPS6145380U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6145380U (ja) | 1986-03-26 |