JPH0238488Y2 - - Google Patents

Info

Publication number

JPH0238488Y2

JPH0238488Y2 JP17213082U JP17213082U JPH0238488Y2 JP H0238488 Y2 JPH0238488 Y2 JP H0238488Y2 JP 17213082 U JP17213082 U JP 17213082U JP 17213082 U JP17213082 U JP 17213082U JP H0238488 Y2 JPH0238488 Y2 JP H0238488Y2

Authority

JP

Japan

Prior art keywords

case

surface wave

wave chip

aluminum

circuit board

Prior art date

1982-11-12

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 229910052782 aluminium Inorganic materials 0.000 claims description 11
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
• VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 7
• BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
• 229910052804 chromium Inorganic materials 0.000 claims description 7
• 239000011651 chromium Substances 0.000 claims description 7
• 229910001120 nichrome Inorganic materials 0.000 claims description 7
• 229910052709 silver Inorganic materials 0.000 claims description 7
• 239000004332 silver Substances 0.000 claims description 7
• 238000010897 surface acoustic wave method Methods 0.000 claims description 6
• 239000004020 conductor Substances 0.000 claims description 4
• 229910052751 metal Inorganic materials 0.000 description 5
• 239000002184 metal Substances 0.000 description 5
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
• 239000011889 copper foil Substances 0.000 description 4
• 238000004519 manufacturing process Methods 0.000 description 4
• PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
• PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
• 229910052737 gold Inorganic materials 0.000 description 2
• 239000010931 gold Substances 0.000 description 2
• 238000010849 ion bombardment Methods 0.000 description 2
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 238000005516 engineering process Methods 0.000 description 1
• 239000012212 insulator Substances 0.000 description 1
• 239000000463 material Substances 0.000 description 1
• 239000000615 nonconductor Substances 0.000 description 1
• 229910052760 oxygen Inorganic materials 0.000 description 1
• 239000001301 oxygen Substances 0.000 description 1
• 238000007740 vapor deposition Methods 0.000 description 1
• 238000011179 visual inspection Methods 0.000 description 1