JPH0238488Y2 - - Google Patents
Info
- Publication number
- JPH0238488Y2 JPH0238488Y2 JP17213082U JP17213082U JPH0238488Y2 JP H0238488 Y2 JPH0238488 Y2 JP H0238488Y2 JP 17213082 U JP17213082 U JP 17213082U JP 17213082 U JP17213082 U JP 17213082U JP H0238488 Y2 JPH0238488 Y2 JP H0238488Y2
- Authority
- JP
- Japan
- Prior art keywords
- case
- surface wave
- wave chip
- aluminum
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 229910052804 chromium Inorganic materials 0.000 claims description 7
- 239000011651 chromium Substances 0.000 claims description 7
- 229910001120 nichrome Inorganic materials 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 238000010897 surface acoustic wave method Methods 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000010849 ion bombardment Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
【考案の詳細な説明】
産業上の利用分野
本考案は、帯域フイルタ・共振器特性を有する
表面波チツプを備えた表面波装置に関するもので
ある。[Detailed Description of the Invention] Industrial Application Field The present invention relates to a surface acoustic wave device equipped with a surface acoustic wave chip having bandpass filter/resonator characteristics.
従来例の構成とその問題点
従来のこの種の表面波装置は、第１図に示す様
に構成されている。すなわち、圧電体１上に一対
の櫛形電極２，３を設けた表面波チツプと、この
表面波チツプを収納する金属ケース１２とからな
つている。この場合、表面波チツプと金属ケース
１２の端子８，９，１０，１１との電気的接続に
は金もしくはアルミニウムのワイヤ４，５，６，
７を用いている。このワイヤ４，５，６，７の接
続技術は、ICやトランジスタの製造にも使用さ
れて確立されているが、ワイヤ径は約30μｍと微
細であること、ワイヤが微細であるため顕微鏡を
使用した作業になること、ワイヤ接続作業に必要
な高価なワイヤボンダ一機の導入が必要であるこ
と、さらにはケースとして高価な金属ケースを用
いなければならないこと等から、作業性・設備投
資・製品単価の点で良好なものとはいえなかつ
た。Structure of a conventional example and its problems A conventional surface acoustic wave device of this type has a structure as shown in FIG. That is, it consists of a surface wave chip with a pair of comb-shaped electrodes 2 and 3 provided on a piezoelectric body 1, and a metal case 12 that houses this surface wave chip. In this case, electrical connections between the surface wave chip and the terminals 8, 9, 10, 11 of the metal case 12 include gold or aluminum wires 4, 5, 6,
7 is used. This connection technology for wires 4, 5, 6, and 7 has been established and is used in the manufacture of ICs and transistors, but the wire diameter is as small as approximately 30 μm, and because the wires are minute, a microscope is used. It is necessary to install an expensive wire bonder for wire connection work, and an expensive metal case must be used as the case. In this respect, it could not be said to be good.
考案の目的
本考案は上記従来の欠点を解消するもので、目
視作業及び簡単な治具により安価に製作できる表
面波装置の堤供を目的とする。Purpose of the invention The present invention eliminates the above-mentioned conventional drawbacks, and aims to provide a surface wave device that can be manufactured at low cost using visual inspection and simple jigs.
考案の構成
上記目的を達するため、本考案の表面波装置
は、圧電体上にアルミニウム製の一対の入出力用
の櫛形電極を形成し、この櫛形電極の表面波チツ
プパツド部分のアルミニウム面上にのみクロム膜
もしくはニクロム膜と銀膜とを層状に形成した表
面波チツプと、この表面波チツプを外装する絶縁
性のケースと、このケースから導出された端子と
を備え、前記ケースの内側に固着された前記表面
波チツプのパツド部分と、前記ケースの内側に形
成されかつ前記端子に電気的に接続された導体と
を導電性ペーストにより電気的に接続した構成で
ある。Structure of the Invention In order to achieve the above object, the surface wave device of the present invention has a pair of aluminum input/output comb-shaped electrodes formed on a piezoelectric body, and only the aluminum surface of the surface wave chip pad of the comb-shaped electrodes is formed on the piezoelectric body. A surface wave chip comprising a layered layer of a chromium film or a nichrome film and a silver film, an insulating case enclosing the surface wave chip, and a terminal led out from the case, and is fixed to the inside of the case. The pad portion of the surface wave chip and a conductor formed inside the case and electrically connected to the terminal are electrically connected by a conductive paste.
なお上記構成においては、櫛形電極を構成する
アルミニウムは大気中の酸素と結合して表面部分
のみ電気的絶縁体のアルミナになるので、イオン
衝撃を行つてアルミナを徐去し、アルミニウムの
層を露出させ、下地となるクロムもしくはニクロ
ムをその上に蒸着し、アルミニウムより酸化しに
くい銀をその上に更に蒸着を行なつている。また
下地となるクロムもしくはニクロムは、蒸着の接
着強度をあげるために設けている。 In the above configuration, the aluminum that makes up the comb-shaped electrode combines with oxygen in the atmosphere and becomes alumina, an electrical insulator, only on the surface, so ion bombardment is performed to gradually remove the alumina and expose the aluminum layer. Then, chromium or nichrome, which serves as a base, is vapor-deposited thereon, and silver, which is less easily oxidized than aluminum, is further vapor-deposited thereon. Further, chromium or nichrome as a base is provided to increase adhesive strength for vapor deposition.
かかる構成によれば、表面波チツプとケースと
の電気的接続部は、導電性ペーストを目視で塗布
することによつて導通が達成され、しかもケース
は絶縁体であるので従来の金属ケースよりも安価
であり、したがつて製作費及び製作のための設備
費共に低減できるのである。 According to this configuration, electrical connection between the surface wave chip and the case is achieved by visually applying a conductive paste, and since the case is an insulator, it is easier to conduct the electrical connection between the surface wave chip and the case than with a conventional metal case. It is inexpensive, and therefore both manufacturing costs and equipment costs for manufacturing can be reduced.
実施例の説明
以下、本考案の一実施例について、図面に基づ
いて説明する。第２図は表面波チツプの斜視図、
第３図は同一部切欠き正面図であり、第１図に示
す構成要素と同一の構成要素には同一の符号を付
してその説明を省略する。第２図及び第３図にお
いて、２１はケースの一部としてのプリント基板
であり、このプリント基板２１上には、圧電体１
上のアルミニウム製櫛形電極２，３の表面波チツ
プパツド部分１３，１４，１５，１６にのみイオ
ン衝撃後順にクロムもしくかニクロム更に銀を蒸
着して、表面波チツプパツド部分１３，１４，１
５，１６のアルミニウム面上にのみクロム膜もし
くはニクロム膜と銀膜とを層状に形成した表面波
チツプが接着されている。前記表面波チツプパツ
ド部分１３，１４，１５，１６とプリント基板２
１の銅箔２２とは、銀ペーストや金ペースト等の
導電性ペースト１７，１８，１９，２０により接
着固定接続されている。前記表面波チツプはキヤ
ツプ２３内に収納され、さらに一部が前記プリン
ト基板２１により構成されている絶縁性のケース
２４により外気としや断されている。電気信号
は、前記プリント基板２１の銅箔２２と接続され
たリード端子２５によつて外部へ取り出される。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. Figure 2 is a perspective view of a surface wave chip.
FIG. 3 is a partially cutaway front view of the same component, and the same components as those shown in FIG. In FIGS. 2 and 3, 21 is a printed circuit board as a part of the case, and on this printed circuit board 21 is a piezoelectric material 1.
After ion bombardment, chromium or nichrome is deposited on only the surface wave chip pad portions 13, 14, 15, 16 of the upper aluminum comb-shaped electrodes 2, 3, and then silver is deposited in order to form the surface wave chip pad portions 13, 14, 1.
A surface wave chip in which a chromium film or a nichrome film and a silver film are formed in layers is bonded only on the aluminum surfaces of Nos. 5 and 16. The surface wave chip pad portions 13, 14, 15, 16 and the printed circuit board 2
The copper foil 22 of No. 1 is adhesively and fixedly connected to the copper foil 22 of No. 1 using conductive pastes 17, 18, 19, and 20 such as silver paste or gold paste. The surface wave chip is housed in a cap 23, and is further isolated from the outside air by an insulating case 24, a portion of which is made up of the printed circuit board 21. The electrical signal is taken out to the outside through a lead terminal 25 connected to the copper foil 22 of the printed circuit board 21.
上記構成によれば、表面波チツプパツド１３〜
１６のアルミニウム面上にのみクロム膜もしくは
ニクロム膜と銀膜とを層状に形成することによ
り、導電性ペースト１７〜２０による接続が可能
になつたことにより、従来のように直径約30μｍ
という微細なワイヤを使用する必要がなく、また
目視可能な導電性ペースト１７〜２０の塗布によ
る作業の簡略化を図れ、また高価なワイヤボンダ
ーを使用する必要がなく、またケース２４として
高価な金属ケースを使用しないで、ケース２４の
一部に廉価なプリント基板２１を用いることがで
き、したがつて表面波装置として廉価な製品が実
現でき、また設備投資が少なくてすむ。 According to the above configuration, the surface wave chip pads 13 to
By forming a layer of chromium film or nichrome film and silver film only on the aluminum surface of No. 16, it is now possible to connect using conductive pastes No. 17 to 20.
There is no need to use fine wires, and the work can be simplified by applying visible conductive pastes 17 to 20. There is also no need to use an expensive wire bonder, and the case 24 can be made of expensive metal. The inexpensive printed circuit board 21 can be used as a part of the case 24 without using a case, and therefore an inexpensive product can be realized as a surface acoustic wave device, and equipment investment can be reduced.
考案の効果
以上説明したように本考案によれば、容易にか
つ安価に表面波装置を製作し得、しかも製作のた
めの設備投資も低減し得る。Effects of the Invention As explained above, according to the present invention, a surface wave device can be manufactured easily and inexpensively, and the capital investment for manufacturing can also be reduced.
第１図は従来の表面波装置の一部切欠き斜視
図、第２図は本考案の一実施例における表面波装
置に用いる表面波チツプの斜視図、第３図は本考
案の一実施例における表面波装置の一部切欠き正
面図である。
１……圧電体、２，３……櫛形電極、１３，１
４，１５，１６……表面波チツプパツド部分，１
７，１８，１９，２０……導電性ペースト、２１
……プリント基板、２２……銅箔（導体）、２４
……ケース、２５……リード端子（端子）。
Fig. 1 is a partially cutaway perspective view of a conventional surface wave device, Fig. 2 is a perspective view of a surface wave chip used in a surface wave device according to an embodiment of the present invention, and Fig. 3 is an embodiment of the present invention. FIG. 2 is a partially cutaway front view of the surface wave device in FIG. 1... Piezoelectric body, 2, 3... Comb-shaped electrode, 13, 1
4, 15, 16...Surface wave chip pad part, 1
7, 18, 19, 20... conductive paste, 21
...Printed circuit board, 22...Copper foil (conductor), 24
...Case, 25...Lead terminal (terminal).
Claims (1)
の櫛形電極を形成し、この櫛形電極の表面波チ
ツプパツド部分のアルミニウム面上にのみクロ
ム膜もしくはニクロム膜と銀膜とを層状に形成
した表面波チツプと、この表面波チツプを外装
する絶縁性のケースと、このケースから導出さ
れた端子とを備え、前記ケースの内側に固着さ
れた前記表面波チツプのパツド部分と、前記ケ
ースの内側に形成されかつ前記端子に電気的に
接続された導体とを導電性ペーストにより電気
的に接続した表面波装置。 ２ ケースの一部はプリント基板により構成さ
れ、このプリント基板部分に前記表面波チツプ
が取付けられかつ前記導体が形成されている実
用新案登録請求の範囲第１項記載の表面波装
置。[Claims for Utility Model Registration] 1. A pair of aluminum input/output comb-shaped electrodes are formed on a piezoelectric body, and a chromium film or a nichrome film and a silver film are formed only on the aluminum surface of the surface wave chip pad portion of the comb-shaped electrodes. a pad portion of the surface wave chip fixed to the inside of the case, comprising: a surface wave chip formed in a layered manner; an insulating case enclosing the surface wave chip; and a terminal led out from the case; and a conductor formed inside the case and electrically connected to the terminal using a conductive paste. 2. The surface acoustic wave device according to claim 1, wherein a part of the case is constituted by a printed circuit board, and the surface acoustic wave chip is attached to the printed circuit board portion and the conductor is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17213082U JPS5976134U (en) | 1982-11-12 | 1982-11-12 | surface wave device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17213082U JPS5976134U (en) | 1982-11-12 | 1982-11-12 | surface wave device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5976134U JPS5976134U (en) | 1984-05-23 |
| JPH0238488Y2 true JPH0238488Y2 (en) | 1990-10-17 |
Family
ID=30375286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17213082U Granted JPS5976134U (en) | 1982-11-12 | 1982-11-12 | surface wave device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5976134U (en) |
-
1982
- 1982-11-12 JP JP17213082U patent/JPS5976134U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5976134U (en) | 1984-05-23 |
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