JPS634365B2 - - Google Patents
Info
- Publication number
- JPS634365B2 JPS634365B2 JP15054280A JP15054280A JPS634365B2 JP S634365 B2 JPS634365 B2 JP S634365B2 JP 15054280 A JP15054280 A JP 15054280A JP 15054280 A JP15054280 A JP 15054280A JP S634365 B2 JPS634365 B2 JP S634365B2
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- circuit board
- printed circuit
- piezoelectric ceramic
- ceramic resonator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 claims description 21
- 239000000853 adhesive Substances 0.000 claims description 17
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- 238000009413 insulation Methods 0.000 description 4
- 238000000605 extraction Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0504—Holders; Supports for bulk acoustic wave devices
- H03H9/0509—Holders; Supports for bulk acoustic wave devices consisting of adhesive elements
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
【発明の詳細な説明】
本発明は圧電磁器共振子のプリント基板への取
付法に関するものであつて、その目的とするとこ
ろは、圧電磁器共振子をプリント基板に半田又は
導電性接着剤で接合する場合に電極間の絶縁不良
ないしは短絡を防止して選択度のすぐれた圧電磁
器共振器をうることにある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for attaching a piezoelectric ceramic resonator to a printed circuit board, and its purpose is to bond a piezoelectric ceramic resonator to a printed circuit board with solder or conductive adhesive. The object of the present invention is to obtain a piezoelectric ceramic resonator with excellent selectivity by preventing poor insulation or short circuit between electrodes.
第１図は厚みのすべり振動を利用する圧電磁器
共振子で、１は圧電磁器共振子、２、２′はその
両側に設けた電極である。第２図は第１図の圧電
磁器共振子を取付けるプリント基板で、点線はそ
の取付位置を示している。同図において、３はプ
リント基板、４、５、６は銅箔を貼着して形成し
たプリント基板の引出用電極で、４は入力端子、
５はアース端子、６は出力端子である。 FIG. 1 shows a piezoelectric ceramic resonator that utilizes thickness shear vibration. 1 is a piezoelectric ceramic resonator, and 2 and 2' are electrodes provided on both sides thereof. FIG. 2 shows a printed circuit board on which the piezoelectric ceramic resonator of FIG. 1 is mounted, and the dotted line indicates the mounting position. In the figure, 3 is a printed circuit board, 4, 5, and 6 are lead-out electrodes of the printed circuit board formed by pasting copper foil, 4 is an input terminal,
5 is a ground terminal, and 6 is an output terminal.
ところで第１図の圧電磁器共振子を第２図のプ
リント基板に接合する場合は、電極２、２′を引
出用電極４、５、６にそれぞれ半田又は導電性接
着剤によつて接着するのであるが、半田又は導電
性接着剤が流出して電極間の絶縁不良ないしは短
絡を生ずることがあるので作業が慎重を要し、そ
のために自動化が困難である。本発明はこの問題
を解決することを意図するものである。 By the way, when bonding the piezoelectric ceramic resonator shown in FIG. 1 to the printed circuit board shown in FIG. However, since the solder or conductive adhesive may flow out and cause poor insulation or short circuits between the electrodes, the work requires careful work and is therefore difficult to automate. The present invention is intended to solve this problem.
本発明は絶縁不良や短絡のおそれがなく、か
つ、自動化の可能な圧電磁器共振器の製造法であ
つて、圧電磁器共振子の両側の電極をプリント基
板の引出用電極の上に載置し、圧電磁器共振子の
電極間の中間の部分を絶縁性接着剤によつてプリ
ント基板に仮接着し、圧電磁器共振子の両側の電
極をプリント基板の引出用電極に半田又は導電性
接着剤によつて接着した後、前記絶縁性接着剤を
溶剤によつて除去することを特徴とする。なお、
本発明において使用される絶縁性接着剤は半田あ
るいは導電性接着剤に対して反撥性（なじまない
こと）を有し、かつ溶剤（トリクロールエタンあ
るいはトリクロールエチレン）に容易に溶解する
物質例えばシリコングリス等が使用される。 The present invention is a method for manufacturing a piezoelectric ceramic resonator that is free from the risk of poor insulation or short circuits and can be automated, in which electrodes on both sides of the piezoelectric ceramic resonator are placed on lead-out electrodes of a printed circuit board. Temporarily bond the intermediate part between the electrodes of the piezoelectric ceramic resonator to the printed circuit board using an insulating adhesive, and then apply solder or conductive adhesive to the electrodes on both sides of the piezoelectric ceramic resonator to the lead-out electrodes of the printed circuit board. After the insulating adhesive is bonded by twisting, the insulating adhesive is removed using a solvent. In addition,
The insulating adhesive used in the present invention is a substance that is repellent (not compatible) with solder or conductive adhesive and easily dissolves in a solvent (trichloroethane or trichlorethylene), such as silicone. Grease etc. are used.
本発明の実施例を第３図によつて説明する。３
はプリント基板、４、５、６はその引出用電極で
ある。圧電磁器共振子１はその両側の電極２、
２′がプリント基板３の引出用電極４、５および
５、６の上にそれぞれ載置され、電極２、２′間
の中間の部分が絶縁性接着剤７によつてプリント
基板３に仮装着されている。８は圧電磁器共振子
１の両側の電極２、２′をプリント基板３の引出
用電極４、５、６に接着する半田又は導電性接着
剤である。 An embodiment of the present invention will be explained with reference to FIG. 3
is a printed circuit board, and 4, 5, and 6 are lead electrodes thereof. The piezoelectric ceramic resonator 1 has electrodes 2 on both sides thereof,
2' are respectively placed on the extraction electrodes 4, 5 and 5, 6 of the printed circuit board 3, and the intermediate part between the electrodes 2, 2' is temporarily attached to the printed circuit board 3 with an insulating adhesive 7. has been done. Reference numeral 8 denotes solder or conductive adhesive for bonding the electrodes 2, 2' on both sides of the piezoelectric ceramic resonator 1 to the lead-out electrodes 4, 5, 6 of the printed circuit board 3.
以上述べたように本発明の製造法は圧電磁器共
振子１の電極２、２′間の中間の部分を絶縁性接
着剤７によつてプリント基板３に仮接着してある
ので、半田又は導電性接着剤８による電極間の絶
縁不良ないしは短絡が、絶縁性接着剤７によつて
防止される。したがつて圧電磁器共振子のプリン
ト基板への取付けを自動化することが可能とな
り、その生産性を向上するすぐれた効果を有す
る。 As described above, in the manufacturing method of the present invention, the intermediate portion between the electrodes 2 and 2' of the piezoelectric ceramic resonator 1 is temporarily bonded to the printed circuit board 3 with the insulating adhesive 7, The insulating adhesive 7 prevents poor insulation or short circuit between the electrodes due to the insulating adhesive 8 . Therefore, it becomes possible to automate the attachment of the piezoelectric ceramic resonator to the printed circuit board, which has an excellent effect of improving productivity.
第１図：圧電磁器共振子の平面図、第２図：第
１図の圧電磁器共振子を取付けるプリント基板の
平面図、第３図：本発明の実施例の説明図。
記号、１……圧電磁器共振子、２、２′……電
極、３……プリント基板、４、５、６……引出用
電極、７……絶縁性接着剤、８……半田又は導電
性接着剤。
FIG. 1: A plan view of a piezoelectric ceramic resonator, FIG. 2: A plan view of a printed circuit board to which the piezoelectric ceramic resonator of FIG. 1 is attached, and FIG. 3: An explanatory diagram of an embodiment of the present invention. Symbol, 1... Piezoelectric ceramic resonator, 2, 2'... Electrode, 3... Printed circuit board, 4, 5, 6... Extraction electrode, 7... Insulating adhesive, 8... Solder or conductive glue.
Claims (1)
の引出用電極の上に載置し、前記圧電磁器共振子
の電極間の中間の部分を絶縁性接着剤によつて前
記プリント基板に仮接着し、前記圧電磁器共振子
の両側の電極を前記プリント基板の引出用電極に
半田又は導電性接着剤によつて接着した後、前記
絶縁性接着剤を溶剤によつて除去することを特徴
とする圧電磁器共振器の製造法。1 Place the electrodes on both sides of the piezoelectric ceramic resonator on the lead-out electrodes of the printed circuit board, and temporarily adhere the intermediate part between the electrodes of the piezoelectric ceramic resonator to the printed circuit board with an insulating adhesive. , a piezoelectric device characterized in that the electrodes on both sides of the piezoelectric ceramic resonator are bonded to the lead-out electrodes of the printed circuit board with solder or a conductive adhesive, and then the insulating adhesive is removed with a solvent. Method of manufacturing a magnetic resonator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15054280A JPS5775017A (en) | 1980-10-27 | 1980-10-27 | Production for piezoelectric forcelain resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15054280A JPS5775017A (en) | 1980-10-27 | 1980-10-27 | Production for piezoelectric forcelain resonator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5775017A JPS5775017A (en) | 1982-05-11 |
| JPS634365B2 true JPS634365B2 (en) | 1988-01-28 |
Family
ID=15499139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15054280A Granted JPS5775017A (en) | 1980-10-27 | 1980-10-27 | Production for piezoelectric forcelain resonator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5775017A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4535841A (en) * | 1983-10-24 | 1985-08-20 | International Business Machines Corporation | High power chip cooling device and method of manufacturing same |
| JPS60103693A (en) * | 1983-11-11 | 1985-06-07 | 株式会社東芝 | Method of producing hybrid integrated circuit |
| JPS62108607A (en) * | 1985-11-06 | 1987-05-19 | Murata Mfg Co Ltd | Piezoelectric parts |
-
1980
- 1980-10-27 JP JP15054280A patent/JPS5775017A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5775017A (en) | 1982-05-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3489508B2 (en) | Conductive cap, electronic component, and method of forming insulating film on conductive cap | |
| JPS634365B2 (en) | ||
| US5449110A (en) | Method of soldering lead terminal to substrate | |
| JP3291762B2 (en) | Solid electrolytic capacitors | |
| JPS58148510A (en) | Method for forming lead terminal on printed circuit board | |
| JPH0666544B2 (en) | Circuit board manufacturing method | |
| JPS6318335B2 (en) | ||
| JPH0460400B2 (en) | ||
| JPS5950596A (en) | Chip type electronic part and method of producing same | |
| JPH0238462Y2 (en) | ||
| JPS6334281Y2 (en) | ||
| JPH0120559B2 (en) | ||
| JPS59204265A (en) | Manufacture of hybrid integrated circuit | |
| JPS5933858A (en) | Manufacture of hybrid integrated circuit | |
| JPH0132330Y2 (en) | ||
| JPH0238488Y2 (en) | ||
| JPS5830191A (en) | Method of mounting leadless part | |
| JPS5855673Y2 (en) | Electronic component mounting equipment | |
| JPH02185198A (en) | Lead extraction structure for piezoelectric body | |
| JP2535573B2 (en) | Method for manufacturing plastic pin grid array | |
| JPS59996B2 (en) | Printed wiring board manufacturing method | |
| JPS61287197A (en) | Manufacture of electronic component | |
| JPS6347149B2 (en) | ||
| JPS6160575B2 (en) | ||
| JPS6174394A (en) | Soldering of lead-free part |