JPH0238446Y2 - - Google Patents

Info

Publication number
JPH0238446Y2
JPH0238446Y2 JP1981122445U JP12244581U JPH0238446Y2 JP H0238446 Y2 JPH0238446 Y2 JP H0238446Y2 JP 1981122445 U JP1981122445 U JP 1981122445U JP 12244581 U JP12244581 U JP 12244581U JP H0238446 Y2 JPH0238446 Y2 JP H0238446Y2
Authority
JP
Japan
Prior art keywords
die
semiconductor element
pad
bonding
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981122445U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5827935U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981122445U priority Critical patent/JPS5827935U/ja
Publication of JPS5827935U publication Critical patent/JPS5827935U/ja
Application granted granted Critical
Publication of JPH0238446Y2 publication Critical patent/JPH0238446Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1981122445U 1981-08-18 1981-08-18 混成集積回路装置 Granted JPS5827935U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981122445U JPS5827935U (ja) 1981-08-18 1981-08-18 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981122445U JPS5827935U (ja) 1981-08-18 1981-08-18 混成集積回路装置

Publications (2)

Publication Number Publication Date
JPS5827935U JPS5827935U (ja) 1983-02-23
JPH0238446Y2 true JPH0238446Y2 (enExample) 1990-10-17

Family

ID=29916366

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981122445U Granted JPS5827935U (ja) 1981-08-18 1981-08-18 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPS5827935U (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58127338A (ja) * 1982-01-25 1983-07-29 Sharp Corp 電子部品の構造
JPS6122728U (ja) * 1984-07-16 1986-02-10 株式会社吉野工業所 容器
US20110257723A1 (en) 2006-11-07 2011-10-20 Dc Devices, Inc. Devices and methods for coronary sinus pressure relief
US9232997B2 (en) 2006-11-07 2016-01-12 Corvia Medical, Inc. Devices and methods for retrievable intra-atrial implants
EP3329860A1 (en) 2006-11-07 2018-06-06 David Stephen Celermajer Devices for the treatment of heart failure
US10413284B2 (en) 2006-11-07 2019-09-17 Corvia Medical, Inc. Atrial pressure regulation with control, sensing, monitoring and therapy delivery
US8740962B2 (en) 2006-11-07 2014-06-03 Dc Devices, Inc. Prosthesis for retrieval and deployment
US9757107B2 (en) 2009-09-04 2017-09-12 Corvia Medical, Inc. Methods and devices for intra-atrial shunts having adjustable sizes
AU2011210741B2 (en) 2010-01-29 2013-08-15 Corvia Medical, Inc. Devices and methods for reducing venous pressure
CN107334512B (zh) 2011-02-10 2021-04-13 可维亚媒体公司 用于建立和保持房内压力释放孔的装置
US12303119B2 (en) 2011-02-10 2025-05-20 Corvia Medical, Inc. Apparatus and methods to create and maintain an intra-atrial pressure relief opening
WO2013096965A1 (en) 2011-12-22 2013-06-27 Dc Devices, Inc. Methods and devices for intra-atrial devices having selectable flow rates
US10675450B2 (en) 2014-03-12 2020-06-09 Corvia Medical, Inc. Devices and methods for treating heart failure
EP3171786B1 (en) 2014-07-23 2020-05-13 Corvia Medical, Inc. Devices for treating heart failure

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55150251A (en) * 1979-05-11 1980-11-22 Hitachi Ltd Semiconductor device
JPS5797634A (en) * 1980-12-11 1982-06-17 Canon Inc Hybrid integrated circuit

Also Published As

Publication number Publication date
JPS5827935U (ja) 1983-02-23

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