JPH0237681B2 - - Google Patents
Info
- Publication number
- JPH0237681B2 JPH0237681B2 JP58208951A JP20895183A JPH0237681B2 JP H0237681 B2 JPH0237681 B2 JP H0237681B2 JP 58208951 A JP58208951 A JP 58208951A JP 20895183 A JP20895183 A JP 20895183A JP H0237681 B2 JPH0237681 B2 JP H0237681B2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- conductor
- pulse voltage
- defects
- film conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010409 thin film Substances 0.000 claims description 75
- 230000007547 defect Effects 0.000 claims description 58
- 239000004020 conductor Substances 0.000 claims description 56
- 238000000034 method Methods 0.000 claims description 22
- 230000008646 thermal stress Effects 0.000 claims description 16
- 238000012216 screening Methods 0.000 claims description 9
- 238000001514 detection method Methods 0.000 description 10
- 239000000523 sample Substances 0.000 description 9
- 239000010408 film Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 230000002950 deficient Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 239000000470 constituent Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58208951A JPS60102707A (ja) | 1983-11-09 | 1983-11-09 | 薄膜形成品のスクリ−ニング方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58208951A JPS60102707A (ja) | 1983-11-09 | 1983-11-09 | 薄膜形成品のスクリ−ニング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60102707A JPS60102707A (ja) | 1985-06-06 |
| JPH0237681B2 true JPH0237681B2 (enrdf_load_stackoverflow) | 1990-08-27 |
Family
ID=16564842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58208951A Granted JPS60102707A (ja) | 1983-11-09 | 1983-11-09 | 薄膜形成品のスクリ−ニング方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60102707A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3179394B2 (ja) | 1997-11-28 | 2001-06-25 | 富山日本電気株式会社 | 印刷配線板の電気検査装置及び電気検査方法 |
| JP2006220652A (ja) * | 2005-02-10 | 2006-08-24 | General Electric Co <Ge> | 電気回路の接合部及び接触部を品質認定するための方法 |
-
1983
- 1983-11-09 JP JP58208951A patent/JPS60102707A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60102707A (ja) | 1985-06-06 |
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