JPH0236044U - - Google Patents

Info

Publication number
JPH0236044U
JPH0236044U JP1988115234U JP11523488U JPH0236044U JP H0236044 U JPH0236044 U JP H0236044U JP 1988115234 U JP1988115234 U JP 1988115234U JP 11523488 U JP11523488 U JP 11523488U JP H0236044 U JPH0236044 U JP H0236044U
Authority
JP
Japan
Prior art keywords
semiconductor pellet
heat sink
resin
lead
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988115234U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988115234U priority Critical patent/JPH0236044U/ja
Publication of JPH0236044U publication Critical patent/JPH0236044U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/183—Connection portion, e.g. seal
    • H01L2924/18301—Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係る樹脂モールド半導体装置
に用いる放熱板の一実施例の斜視図、第２図は本
考案の樹脂モールド半導体装置の斜視図、第３図
は本考案の樹脂モールド半導体装置の樹脂モール
ド時の効果について説明する樹脂モールド金型の
断面図、第４図は従来の樹脂モールド半導体装置
の斜視図、第５図は従来の樹脂モールド半導体装
置の断面図、第６図は従来の樹脂モールド半導体
装置の未充填不良例を示す下面斜視図、第７図は
未充填不良の発生原因について説明するための樹
脂モールド金型の断面図である。 ２，３，４……リード、５……半導体ペレツト
、６，７……ボンデイングワイヤ、９……樹脂、
３１……放熱板、３３……遮蔽板、３４……窓。

Claims (1)

  1. 【実用新案登録請求の範囲】 放熱板に半導体ペレツトをマウントするととも
    に、半導体ペレツトの表面電極をボンデイングワ
    イヤにてリードに接続し、さらに樹脂にて放熱板
    、半導体ペレツト、ボンデイングワイヤおよびリ
    ードの一部を、放熱板の半導体ペレツトマウント
    側が厚く、それとは反対側が薄くなるよにモール
    ドしてなる樹脂モールド半導体装置において、 前記放熱板の半導体ペレツトマウント部分とリ
    ードと反対側端部との間に、半導体ペレツトマウ
    ント側に突設された遮蔽板と、この遮蔽板の半導
    体ペレツトのマウント側と反対側に開口した窓を
    設けたことを特徴とする樹脂モールド半導体装置
    。
JP1988115234U 1988-08-31 1988-08-31 Pending JPH0236044U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988115234U JPH0236044U (ja) 1988-08-31 1988-08-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988115234U JPH0236044U (ja) 1988-08-31 1988-08-31

Publications (1)

Publication Number Publication Date
JPH0236044U true JPH0236044U (ja) 1990-03-08

Family

ID=31356709

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988115234U Pending JPH0236044U (ja) 1988-08-31 1988-08-31

Country Status (1)

Country Link
JP (1) JPH0236044U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6322747B2 (ja) * 1982-06-24 1988-05-13 Fujitsu Ltd

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6322747B2 (ja) * 1982-06-24 1988-05-13 Fujitsu Ltd

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