JPH0233428U - - Google Patents

Info

Publication number
JPH0233428U
JPH0233428U JP11122488U JP11122488U JPH0233428U JP H0233428 U JPH0233428 U JP H0233428U JP 11122488 U JP11122488 U JP 11122488U JP 11122488 U JP11122488 U JP 11122488U JP H0233428 U JPH0233428 U JP H0233428U
Authority
JP
Japan
Prior art keywords
wafer
holding
section
guide
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11122488U
Other languages
Japanese (ja)
Other versions
JP2543994Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988111224U priority Critical patent/JP2543994Y2/en
Publication of JPH0233428U publication Critical patent/JPH0233428U/ja
Application granted granted Critical
Publication of JP2543994Y2 publication Critical patent/JP2543994Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａ乃至第３図は本発明の実施例に係り、
第２図は本考案に適用される横形ボートを示す斜
視図、第１図ａ，ｂは該ボートを構成する支持棒
に刻設された保持溝の断面形状を示す断面図、第
３図は保持溝の底面幅ａ１と挾角θ１と、ウエハ
に発生する傷の量との関係を示すグラフ図である
。第４図は従来技術に係る保持溝の断面形状を示
す断面図である。 Ａ：半導体ウエハ、１０：保持部、２０：案内
部、１１：底面、２０：案内部、１２，１３：側
壁、Ｗ：ウエハ肉厚、θ１：挾角θ１。 FIGS. 1a to 3 relate to embodiments of the present invention,
Fig. 2 is a perspective view showing a horizontal boat applied to the present invention, Figs. FIG. 2 is a graph diagram showing the relationship between the bottom width a 1 and the angle θ 1 of the holding groove and the amount of scratches generated on the wafer. FIG. 4 is a cross-sectional view showing the cross-sectional shape of a holding groove according to the prior art. A: Semiconductor wafer, 10: Holding section, 20: Guide section, 11: Bottom surface, 20: Guide section, 12, 13: Side wall, W: Wafer thickness, θ 1 : Angular angle θ 1 .

Claims (1)

【実用新案登録請求の範囲】 半導体ウエハを保持する保持溝を所定間隔存し
て多数刻設したウエハ保持治具において、半導体
ウエハの周縁を嵌合保持する保持部開口側に、ウ
エハを保持部に案内させる断面末拡がり状の案内
部を設けるとともに、前記保持部の底面にウエハ
周端が接触可能に、その底面幅ａ１を １．０１Ｗ≦ａ１≦１．５Ｗ［Ｗ：半導体ウエ
ハ肉厚］の範囲に設定しつつ、該底面より案内部
側に向かう一対の側壁間の挾角θ１を２°〜１２
°の範囲に設定した事を特徴とするウエハ保持装
置。[Claim for Utility Model Registration] In a wafer holding jig in which a number of holding grooves for holding a semiconductor wafer are carved at predetermined intervals, the wafer is placed on the opening side of the holding part that fits and holds the periphery of the semiconductor wafer. In addition to providing a guide section with a widening cross-section to guide the wafer, the bottom surface width a 1 is set such that 1.01W≦a 1 ≦1.5W [W: semiconductor wafer thickness] so that the peripheral edge of the wafer can contact the bottom surface of the holding section. thickness], while setting the angle θ 1 between the pair of side walls from the bottom surface toward the guide part to 2° to 12°.
A wafer holding device characterized in that it is set within a range of °.
JP1988111224U 1988-08-26 1988-08-26 Wafer holding jig Expired - Lifetime JP2543994Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988111224U JP2543994Y2 (en) 1988-08-26 1988-08-26 Wafer holding jig

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988111224U JP2543994Y2 (en) 1988-08-26 1988-08-26 Wafer holding jig

Publications (2)

Publication Number Publication Date
JPH0233428U true JPH0233428U (en) 1990-03-02
JP2543994Y2 JP2543994Y2 (en) 1997-08-13

Family

ID=31349088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988111224U Expired - Lifetime JP2543994Y2 (en) 1988-08-26 1988-08-26 Wafer holding jig

Country Status (1)

Country Link
JP (1) JP2543994Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010141221A (en) * 2008-12-15 2010-06-24 Shin-Etsu Chemical Co Ltd Method of manufacturing silicon substrate with oxide film

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52139758U (en) * 1976-04-16 1977-10-22
JPS55110035A (en) * 1979-02-16 1980-08-25 Hitachi Ltd Jig for heat treating wafer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52139758U (en) * 1976-04-16 1977-10-22
JPS55110035A (en) * 1979-02-16 1980-08-25 Hitachi Ltd Jig for heat treating wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010141221A (en) * 2008-12-15 2010-06-24 Shin-Etsu Chemical Co Ltd Method of manufacturing silicon substrate with oxide film

Also Published As

Publication number Publication date
JP2543994Y2 (en) 1997-08-13

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term