JPH0233427U - - Google Patents

Description

[Brief explanation of drawings]

FIG. 1 shows a horizontal boat according to an embodiment of the present invention, in which a is an overall perspective view, b is a cross-sectional view, and c is a sectional view of a main part showing the cross-sectional shape of a retaining groove carved in the boat. . d is an explanatory diagram. Figure 3 is a cross-sectional view of the main part showing the cross-sectional shape of the retaining groove applied to other horizontal boats, Figure 2 is a cross-sectional view of the main part showing the cross-sectional shape of the retaining groove used in vertical boats, and Figure 4 5 is a perspective view showing a vertical boat in which the holding groove is carved, and FIG. 5 is a sectional view of a main part showing the cross-sectional shape of the holding groove according to the prior art. 1: semiconductor wafer, w: wall thickness, 2A, 2B, 2
C: Holding groove, 3A, 3B, 3C: Bottom surface, d ₁ : Bottom width, 4A, 5A, 4B, 5B, 4C, 5C: Side wall, 31, 32: Bottom end, 41, 52: Open end, 5
1: direction change site, 53: first surface, 54: second surface.

Claims (1)

[Claims for Utility Model Registration] (1) In a semiconductor wafer holding jig having a holding groove that holds the periphery of a semiconductor wafer by supporting at one or more points, the shape of the groove in at least a portion of the holding groove that contacts the wafer periphery. has a pair of side walls formed toward the opening side from both ends of the bottom surface formed with a bottom width approximately equal to or slightly larger than the wafer thickness, and one side wall is located closer to the opening end than the bottom end. The other side wall is a deflection wall that is deflected at a position halfway toward the opening end from the bottom end, and the deflection wall is
A first surface that holds the wafer in almost surface contact from the bottom end position to the deflection section, and a second surface that holds the wafer in a direction in which the facing distance between the open end and the wafer is gradually spaced apart from the deflection section. A semiconductor wafer holding jig characterized by a combination of surfaces. (2) The other side wall has a first surface that is in surface contact with the semiconductor wafer from the bottom end position, and a second surface that is changed in a direction in which the facing distance with the wafer is gradually separated from the direction changing portion. The semiconductor wafer holding jig according to claim 1, wherein the maximum surface depth of the second surface is 1/5 or more of the bottom width. (3) A semiconductor wafer is configured to be able to make surface contact with the inclined side wall, and a first surface extending from the bottom end of the other side wall is formed parallel to the inclined side wall so that the semiconductor wafer can be fitted therein. The semiconductor wafer holding jig described in (1).